Chuang; Chun-Chieh
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chuang; Chun-Chieh.The latest application filed is for "hybrid bond pad structure".
Company Profile
24.97.88
- Chuang; Chun-Chieh - Tainan TW
- Chuang; Chun-Chieh - Tainan City TW
- CHUANG; Chun-Chieh - TAIPEI TW
- Chuang; Chun-Chieh - Hsin-Chu N/A TW
- Chuang; Chun-Chieh - Hsinchu TW
- Chuang; Chun-Chieh - Chi-Lung TW
- Chuang; Chun-Chieh - Keelung TW
Patent Activity
| Patent | Date |
|---|---|
| Image sensor including dual isolation and method of making the same Grant 11,152,414 - Lin , et al. October 19, 2 | 2021-10-19 |
| Hybrid Bond Pad Structure App 20210288029 - Huang; Sin-Yao ; et al. | 2021-09-16 |
| Hybrid bond pad structure Grant 11,024,602 - Huang , et al. June 1, 2 | 2021-06-01 |
| Structure and method for 3D image sensor Grant 11,011,567 - Kao , et al. May 18, 2 | 2021-05-18 |
| Mechanisms for forming image-sensor device with epitaxial isolation feature Grant 10,886,320 - Hsu , et al. January 5, 2 | 2021-01-05 |
| Image sensor device and method of forming same Grant 10,879,297 - Wang , et al. December 29, 2 | 2020-12-29 |
| Interconnect structure for stacked device and method Grant 10,861,899 - Chuang , et al. December 8, 2 | 2020-12-08 |
| Interconnect Structure and Method of Forming Same App 20200306552 - Tsai; Shu-Ting ; et al. | 2020-10-01 |
| Interconnect structure and method of forming same Grant 10,682,523 - Tsai , et al. | 2020-06-16 |
| Interconnect Structure for Stacked Device and Method App 20200127027 - Chuang; Chun-Chieh ; et al. | 2020-04-23 |
| Structure and Method for 3D Image Sensor App 20200075659 - Kao; Min-Feng ; et al. | 2020-03-05 |
| Structure and method for 3D Image sensor Grant 10,535,697 - Kao , et al. Ja | 2020-01-14 |
| Interconnect structure for stacked device and method Grant 10,535,706 - Chuang , et al. Ja | 2020-01-14 |
| Semiconductor devices, methods of manufacturing thereof, and image sensor devices Grant 10,515,994 - Chuang , et al. Dec | 2019-12-24 |
| Mechanisms For Forming Image-sensor Device With Epitaxial Isolation Feature App 20190244990 - Hsu; Wen-I ; et al. | 2019-08-08 |
| Image Sensor Device and Method of Forming Same App 20190244999 - Wang; Wen-De ; et al. | 2019-08-08 |
| Hybrid Bond Pad Structure App 20190221548 - Huang; Sin-Yao ; et al. | 2019-07-18 |
| Image Sensor Including Dual Isolation And Method Of Making The Same App 20190172857 - LIN; Jeng-Shyan ; et al. | 2019-06-06 |
| Image sensor device and method of forming same Grant 10,290,671 - Wang , et al. | 2019-05-14 |
| Interconnect Structure for Stacked Device and Method App 20190131330 - Chuang; Chun-Chieh ; et al. | 2019-05-02 |
| Mechanisms for forming image-sensor device with expitaxial isolation feature Grant 10,276,622 - Hsu , et al. | 2019-04-30 |
| Hybrid bond pad structure Grant 10,269,770 - Huang , et al. | 2019-04-23 |
| Interconnect Structure and Method of Forming Same App 20190046806 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
| Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices App 20190043912 - Chuang; Chun-Chieh ; et al. | 2019-02-07 |
| Image sensor including dual isolation and method of making the same Grant 10,192,918 - Lin , et al. Ja | 2019-01-29 |
| 3DIC Interconnect Apparatus and Method App 20180366447 - Tsai; Shu-Ting ; et al. | 2018-12-20 |
| Interconnect structure for stacked device and method Grant 10,157,959 - Chuang , et al. Dec | 2018-12-18 |
| Three-dimensional Positioning System And Method Thereof App 20180329483 - HSIEH; Ping-Fu ; et al. | 2018-11-15 |
| Interconnect structure and method of forming same Grant 10,092,768 - Tsai , et al. October 9, 2 | 2018-10-09 |
| Semiconductor devices, methods of manufacturing thereof, and image sensor devices Grant 10,090,353 - Chuang , et al. October 2, 2 | 2018-10-02 |
| 3DIC interconnect apparatus and method Grant 10,056,353 - Tsai , et al. August 21, 2 | 2018-08-21 |
| Interconnect Structure For Stacked Device And Method App 20180130836 - Chuang; Chun-Chieh ; et al. | 2018-05-10 |
| Structure and Method for 3D Image Sensor App 20180061880 - Kao; Min-Feng ; et al. | 2018-03-01 |
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,887,182 - Chen , et al. February 6, 2 | 2018-02-06 |
| Mechanisms For Forming Image-sensor Device With Expitaxial Isolation Feature App 20180033812 - Hsu; Wen-I ; et al. | 2018-02-01 |
| Image Sensor Device And Method Of Forming Same App 20180026069 - Wang; Wen-De ; et al. | 2018-01-25 |
| Interconnect structure for stacked device and method Grant 9,865,645 - Chuang , et al. January 9, 2 | 2018-01-09 |
| Interconnect Structure and Method of Forming Same App 20180001099 - Tsai; Shu-Ting ; et al. | 2018-01-04 |
| Backside structure and methods for BSI image sensors Grant 9,837,464 - Chuang , et al. December 5, 2 | 2017-12-05 |
| Structure and method for 3D image sensor Grant 9,812,487 - Kao , et al. November 7, 2 | 2017-11-07 |
| 3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers App 20170309603 - Chen; Ju-Shi ; et al. | 2017-10-26 |
| Hybrid Bond Pad Structure App 20170287878 - Huang; Sin-Yao ; et al. | 2017-10-05 |
| Mechanisms for forming image-sensor device with epitaxial isolation feature Grant 9,780,137 - Hsu , et al. October 3, 2 | 2017-10-03 |
| Image sensor device and method of forming same Grant 9,773,828 - Wang , et al. September 26, 2 | 2017-09-26 |
| Interconnect structure and method of forming same Grant 9,764,153 - Tsai , et al. September 19, 2 | 2017-09-19 |
| Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices App 20170263667 - Chuang; Chun-Chieh ; et al. | 2017-09-14 |
| Hybrid bond using a copper alloy for yield improvement Grant 9,728,521 - Tsai , et al. August 8, 2 | 2017-08-08 |
| Hybrid bond pad structure Grant 9,704,827 - Huang , et al. July 11, 2 | 2017-07-11 |
| Backside Structure and Methods for BSI Image Sensors App 20170162622 - Chuang; Chun-Chieh ; et al. | 2017-06-08 |
| Dual metal for a backside package of backside illuminated image sensor Grant 9,673,246 - Chuang , et al. June 6, 2 | 2017-06-06 |
| Semiconductor devices, methods of manufacturing thereof, and image sensor devices Grant 9,666,630 - Chuang , et al. May 30, 2 | 2017-05-30 |
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,666,566 - Chen , et al. May 30, 2 | 2017-05-30 |
| Method and apparatus for low resistance image sensor contact Grant 9,627,430 - Kao , et al. April 18, 2 | 2017-04-18 |
| Structure and Method for 3D Image Sensor App 20170098679 - Kao; Min-Feng ; et al. | 2017-04-06 |
| Backside structure and methods for BSI image sensors Grant 9,613,996 - Chuang , et al. April 4, 2 | 2017-04-04 |
| Backside structure and methods for BSI image sensors Grant 9,576,999 - Chuang , et al. February 21, 2 | 2017-02-21 |
| Ridge structure for back side illuminated image sensor Grant 9,570,503 - Chuang , et al. February 14, 2 | 2017-02-14 |
| CMOS image sensors and methods for forming the same Grant 9,559,244 - Kao , et al. January 31, 2 | 2017-01-31 |
| Hybrid Bond Using A Copper Alloy For Yield Improvement App 20170025381 - Tsai; Yu-Cheng ; et al. | 2017-01-26 |
| Hybrid Bond Pad Structure App 20160379960 - Huang; Sin-Yao ; et al. | 2016-12-29 |
| Structure and method for 3D image sensor Grant 9,525,003 - Kao , et al. December 20, 2 | 2016-12-20 |
| Backside Structure and Methods for BSI Image Sensors App 20160336367 - Chuang; Chun-Chieh ; et al. | 2016-11-17 |
| Interconnect Structure For Stacked Device And Method App 20160276383 - Chuang; Chun-Chieh ; et al. | 2016-09-22 |
| Backside Structure and Methods for BSI Image Sensors App 20160218126 - Chuang; Chun-Chieh ; et al. | 2016-07-28 |
| Backside structure and methods for BSI image sensors Grant 9,401,380 - Chuang , et al. July 26, 2 | 2016-07-26 |
| Semiconductor devices, methods of manufacturing thereof, and image sensor devices Grant 9,391,114 - Chuang , et al. July 12, 2 | 2016-07-12 |
| Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices App 20160197114 - Chuang; Chun-Chieh ; et al. | 2016-07-07 |
| System and method for fabricating a 3D image sensor structure Grant 9,373,657 - Kao , et al. June 21, 2 | 2016-06-21 |
| Interconnect structure for stacked device and method Grant 9,356,066 - Chuang , et al. May 31, 2 | 2016-05-31 |
| Backside structure for BSI image sensor Grant 9,356,058 - Chuang , et al. May 31, 2 | 2016-05-31 |
| Method and Apparatus for Low Resistance Image Sensor Contact App 20160141325 - Kao; Min-Feng ; et al. | 2016-05-19 |
| Semiconductor devices, methods of manufacturing thereof, and image sensor devices Grant 9,312,294 - Chuang , et al. April 12, 2 | 2016-04-12 |
| Backside structure and method for BSI image sensors Grant 9,305,966 - Chuang , et al. April 5, 2 | 2016-04-05 |
| Imaging sensor structure and method Grant 9,287,312 - Kao , et al. March 15, 2 | 2016-03-15 |
| Image Sensor Including Dual Isolation And Method Of Making The Same App 20160043121 - LIN; Jeng-Shyan ; et al. | 2016-02-11 |
| Method and apparatus for low resistance image sensor contact Grant 9,245,912 - Kao , et al. January 26, 2 | 2016-01-26 |
| Image Sensor Device And Method Of Forming Same App 20160005780 - WANG; Wen-De ; et al. | 2016-01-07 |
| Dual shallow trench isolation and related applications Grant 9,196,547 - Lin , et al. November 24, 2 | 2015-11-24 |
| Structure and Method for 30 Image Sensor App 20150279893 - KAO; Min-Feng ; et al. | 2015-10-01 |
| CMOS image sensor structure Grant 9,147,703 - Kao , et al. September 29, 2 | 2015-09-29 |
| Pad design for backside illuminated image sensor Grant 9,142,586 - Wang , et al. September 22, 2 | 2015-09-22 |
| CMOS Image Sensors and Methods for Forming the Same App 20150263214 - Kao; Min-Feng ; et al. | 2015-09-17 |
| CMOS image sensors and methods for forming the same Grant 9,076,708 - Kao , et al. July 7, 2 | 2015-07-07 |
| Ridge Structure for Back Side Illuminated Image Sensor App 20150187834 - Chuang; Chun-Chieh ; et al. | 2015-07-02 |
| 3DIC Interconnect Apparatus and Method App 20150179613 - Tsai; Shu-Ting ; et al. | 2015-06-25 |
| Structure and method for 3D image sensor Grant 9,059,061 - Kao , et al. June 16, 2 | 2015-06-16 |
| CMOS image sensors and methods for forming the same Grant 9,048,162 - Kao , et al. June 2, 2 | 2015-06-02 |
| Mechanisms For Forming Image-sensor Device With Epitaxial Isolation Feature App 20150145096 - HSU; Wen-I ; et al. | 2015-05-28 |
| Backside Structure and Method for BSI Image Sensors App 20150140722 - Chuang; Chun-Chieh ; et al. | 2015-05-21 |
| Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices App 20150115389 - Chuang; Chun-Chieh ; et al. | 2015-04-30 |
| Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices App 20150115386 - Chuang; Chun-Chieh ; et al. | 2015-04-30 |
| Ridge structure for back side illuminated image sensor Grant 8,981,510 - Chuang , et al. March 17, 2 | 2015-03-17 |
| Backside structure and methods for BSI image sensors Grant 8,969,991 - Chuang , et al. March 3, 2 | 2015-03-03 |
| Backside illuminated image sensor having capacitor on pixel region Grant 8,895,349 - Chuang , et al. November 25, 2 | 2014-11-25 |
| Interconnect Structure and Method of Forming Same App 20140264883 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
| Structure and Method for 3D Image Sensor App 20140264508 - Kao; Min-Feng ; et al. | 2014-09-18 |
| Imaging Sensor Structure and Method App 20140264683 - Kao; Min-Feng ; et al. | 2014-09-18 |
| Method and Apparatus for Low Resistance Image Sensor Contact App 20140264504 - Kao; Min-Feng ; et al. | 2014-09-18 |
| Interconnect Sructure for Stacked Device and Method App 20140264682 - Chuang; Chun-Chieh ; et al. | 2014-09-18 |
| Image Sensor with Improved Dark Current Performance App 20140252521 - Kao; Min-Feng ; et al. | 2014-09-11 |
| Backside Structure and Methods for BSI Image Sensors App 20140252523 - Chuang; Chun-Chieh ; et al. | 2014-09-11 |
| CMOS Image Sensors and Methods for Forming the Same App 20140248734 - Kao; Min-Feng ; et al. | 2014-09-04 |
| Sensor structure for optical performance enhancement Grant 8,816,457 - Hung , et al. August 26, 2 | 2014-08-26 |
| Front side implanted guard ring structure for backside Grant 8,810,700 - Wang , et al. August 19, 2 | 2014-08-19 |
| Back side defect reduction for back side illuminated image sensor Grant 8,809,098 - Chuang , et al. August 19, 2 | 2014-08-19 |
| Backside Structure and Methods for BSI Image Sensors App 20140159190 - Chuang; Chun-Chieh ; et al. | 2014-06-12 |
| Backside structure for a BSI image sensor device Grant 8,736,006 - Tsai , et al. May 27, 2 | 2014-05-27 |
| System and Method for Fabricating a 3D Image Sensor Structure App 20140138752 - Kao; Min-Feng ; et al. | 2014-05-22 |
| Backside structure and methods for BSI image sensors Grant 8,709,854 - Chuang , et al. April 29, 2 | 2014-04-29 |
| Image sensor and method of fabricating same Grant 8,674,467 - Wang , et al. March 18, 2 | 2014-03-18 |
| Back Side Defect Reduction for Back Side Illuminated Image Sensor App 20140073080 - Chuang; Chun-Chieh ; et al. | 2014-03-13 |
| System and method for fabricating a 3D image sensor structure Grant 8,669,135 - Kao , et al. March 11, 2 | 2014-03-11 |
| System and Method for Fabricating a 3D Image Sensor Structure App 20140042445 - Kao; Min-Feng ; et al. | 2014-02-13 |
| Novel CMOS Image Sensor Structure App 20140035013 - Kao; Min-Feng ; et al. | 2014-02-06 |
| Backside Illuminated Image Sensor Having Capacitor On Pixel Region App 20140030842 - CHUANG; Chun-Chieh ; et al. | 2014-01-30 |
| Method and structure to reduce dark current in image sensors Grant 8,624,311 - Chuang , et al. January 7, 2 | 2014-01-07 |
| Back side defect reduction for back side illuminated image sensor Grant 8,614,495 - Chuang , et al. December 24, 2 | 2013-12-24 |
| Front Side Implanted Guard Ring Structure For Backside App 20130334645 - WANG; Wen-De ; et al. | 2013-12-19 |
| Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same Grant 8,604,405 - Liu , et al. December 10, 2 | 2013-12-10 |
| CMOS Image Sensors and Methods for Forming the Same App 20130320420 - Kao; Min-Feng ; et al. | 2013-12-05 |
| Backside Structure and Methods for BSI Image Sensors App 20130299886 - Chuang; Chun-Chieh ; et al. | 2013-11-14 |
| Backside Structure for BSI Image Sensor App 20130299931 - Chuang; Chun-Chieh ; et al. | 2013-11-14 |
| Backside illuminated image sensor having capacitor on pixel region Grant 8,569,807 - Chuang , et al. October 29, 2 | 2013-10-29 |
| CMOS image sensor structure Grant 8,564,085 - Kao , et al. October 22, 2 | 2013-10-22 |
| Front side implanted guard ring structure for backside illuminated image sensor Grant 8,531,565 - Wang , et al. September 10, 2 | 2013-09-10 |
| Back side illuminated image sensor with improved stress immunity Grant 8,405,182 - Chou , et al. March 26, 2 | 2013-03-26 |
| Image sensor with deep trench isolation structure Grant 8,390,089 - Chen , et al. March 5, 2 | 2013-03-05 |
| Dual Metal For A Backside Package Of Backside Illuminated Image Sensor App 20130026467 - Chuang; Chun-Chieh ; et al. | 2013-01-31 |
| Novel Cmos Image Sensor Structure App 20130020662 - Kao; Min-Feng ; et al. | 2013-01-24 |
| Sensor Structure For Optical Performance Enhancement App 20120280346 - Hung; Jhy-Ming ; et al. | 2012-11-08 |
| Back Side Illuminated Image Sensor With Improved Stress Immunity App 20120280348 - CHOU; Keng-Yu ; et al. | 2012-11-08 |
| Image Sensor and Method of Fabricating Same App 20120273914 - Wang; Wen-De ; et al. | 2012-11-01 |
| Dual metal for a backside package of backside illuminated image sensor Grant 8,293,122 - Chuang , et al. October 23, 2 | 2012-10-23 |
| Image sensor and method of fabricating same Grant 8,227,288 - Wang , et al. July 24, 2 | 2012-07-24 |
| Sensor structure for optical performance enhancement Grant 8,222,710 - Hung , et al. July 17, 2 | 2012-07-17 |
| Transmission power control method and system Grant 8,218,475 - Lee , et al. July 10, 2 | 2012-07-10 |
| Method for generating two dimensions for different implant energies Grant 8,202,791 - Chuang , et al. June 19, 2 | 2012-06-19 |
| Photodiode with multi-epi films for image sensor Grant 8,164,124 - Liu , et al. April 24, 2 | 2012-04-24 |
| Image Sensor with Deep Trench Isolation Structure App 20120025199 - Chen; Szu-Ying ; et al. | 2012-02-02 |
| Method And Structure To Reduce Dark Current In Image Sensors App 20120007156 - Chuang; Chun-Chieh ; et al. | 2012-01-12 |
| Ridge Structure For Back Side Illuminated Image Sensor App 20110298072 - Chuang; Chun-Chieh ; et al. | 2011-12-08 |
| Back Side Defect Reduction For Back Side Illuminated Image Sensor App 20110260280 - Chuang; Chun-Chieh ; et al. | 2011-10-27 |
| Method and structure to reduce dark current in image sensors Grant 8,030,114 - Chuang , et al. October 4, 2 | 2011-10-04 |
| Method of implantation Grant 7,968,424 - Lin , et al. June 28, 2 | 2011-06-28 |
| Safety syringe Grant 7,927,301 - Tseng , et al. April 19, 2 | 2011-04-19 |
| Backside Illuminated Image Sensor Having Capacitor On Pixel Region App 20110049589 - CHUANG; Chun-Chieh ; et al. | 2011-03-03 |
| Dual Shallow Trench Isolation And Related Applications App 20100252870 - LIN; Jeng-Shyan ; et al. | 2010-10-07 |
| Method And Apparatus Of Improving Efficiency Of An Image Sensor App 20100243868 - Liu; Han-Chi ; et al. | 2010-09-30 |
| Image Sensor And Method Of Fabricating Same App 20100244173 - Wang; Wen-De ; et al. | 2010-09-30 |
| Method For Generating Two Dimensions For Different Implant Energies App 20100233871 - Chuang; Chun-Chieh ; et al. | 2010-09-16 |
| Front Side Implanted Guard Ring Structure For Backside Illuminated Image Sensor App 20100220226 - WANG; Wen-De ; et al. | 2010-09-02 |
| Pad Design For Backside Illuminated Image Sensor App 20100213560 - Wang; Wen-De ; et al. | 2010-08-26 |
| Dual Metal For A Backside Package Of Backside Illuminated Image Sensor App 20100181283 - Chuang; Chun-Chieh ; et al. | 2010-07-22 |
| Method Of Implantation App 20100184242 - Lin; Jeng-Shyan ; et al. | 2010-07-22 |
| Transmission Power Control Method And System App 20100142425 - LEE; JIN-SHYAN ; et al. | 2010-06-10 |
| Safety Syringe App 20100125252 - Tseng; Hsi-Hsun ; et al. | 2010-05-20 |
| Sensor Structure For Optical Performance Enhancement App 20090315131 - Hung; Jhy-Ming ; et al. | 2009-12-24 |
| Isolation Structure For Image Sensor Device App 20080303932 - Wang; Wen-De ; et al. | 2008-12-11 |
| Method for non-volatile memory fabrication Grant 7,459,371 - Tseng , et al. December 2, 2 | 2008-12-02 |
| Photodiode With Multi-epi Films For Image Sensor App 20080246063 - Liu; Jen-Cheng ; et al. | 2008-10-09 |
| Safety syringe with needle retracting mechanism Grant 7,410,478 - Yang August 12, 2 | 2008-08-12 |
| Method And Structure To Reduce Dark Current In Image Sensors App 20080179640 - Chuang; Chun-Chieh ; et al. | 2008-07-31 |
| Method for non-volatile memory fabrication App 20060286762 - Tseng; Tseung-Yuen ; et al. | 2006-12-21 |
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