Chuang; Chita
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chuang; Chita.The latest application filed is for "connector structure and method of forming same".
Company Profile
21.55.58
- Chuang; Chita - Hsinchu TW
- Chuang; Chita - Hsin-Chu TW
- CHUANG; Chita - Kaohsiung City TW
- CHUANG; CHITA - HSINCHU CITY TW
- Chuang; Chita - Kaohsiung TW
Patent Activity
| Patent | Date |
|---|---|
| Stress reduction apparatus and method Grant 11,244,940 - Chuang , et al. February 8, 2 | 2022-02-08 |
| Bonded structures for package and substrate Grant 11,088,102 - Cha , et al. August 10, 2 | 2021-08-10 |
| Connector Structure and Method of Forming Same App 20210118833 - Chen; Chen-Shien ; et al. | 2021-04-22 |
| Substrate pad structure Grant 10,867,810 - Liu , et al. December 15, 2 | 2020-12-15 |
| Connector structure and method of forming same Grant 10,861,811 - Chen , et al. December 8, 2 | 2020-12-08 |
| Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof App 20200350782 - Yu; Chen-Hua ; et al. | 2020-11-05 |
| Stress Reduction Apparatus and Method App 20200321326 - Chuang; Yao-Chun ; et al. | 2020-10-08 |
| Elongated bump structures in package structure Grant 10,784,223 - Chuang , et al. Sept | 2020-09-22 |
| Substrate pad structure Grant 10,748,785 - Liu , et al. A | 2020-08-18 |
| Dummy flip chip bumps for reducing stress Grant 10,734,347 - Wu , et al. | 2020-08-04 |
| Wireless charging devices having wireless charging coils and methods of manufacture thereof Grant 10,720,788 - Yu , et al. | 2020-07-21 |
| Stress reduction apparatus and method Grant 10,692,848 - Chuang , et al. | 2020-06-23 |
| Bonded Structures for Package and Substrate App 20200098714 - Cha; Ming-Hong ; et al. | 2020-03-26 |
| Semiconductor Device And Package Assembly Including The Same App 20200098712 - CHUANG; Chita ; et al. | 2020-03-26 |
| Substrate Pad Structure App 20200013710 - Liu; Hao-Juin ; et al. | 2020-01-09 |
| Stress Reduction Apparatus and Method App 20200006311 - Chuang; Yao-Chun ; et al. | 2020-01-02 |
| Bump on pad (BOP) bonding structure in semiconductor packaged device Grant 10,515,917 - Chuang , et al. Dec | 2019-12-24 |
| Method For Manufacturing Semiconductor Device App 20190371718 - TSENG; HUA-WEI ; et al. | 2019-12-05 |
| Packaging assembly and method of making the same Grant 10,483,225 - Chuang , et al. Nov | 2019-11-19 |
| Bonded structures for package and substrate Grant 10,468,366 - Cha , et al. No | 2019-11-05 |
| Connector Structure and Method of Forming Same App 20190279953 - Chen; Chen-Shien ; et al. | 2019-09-12 |
| Dummy Flip Chip Bumps for Reducing Stress App 20190259724 - Wu; Sheng-Yu ; et al. | 2019-08-22 |
| Connector structure and method of forming same Grant 10,388,620 - Chen , et al. A | 2019-08-20 |
| Dummy flip chip bumps for reducing stress Grant 10,290,600 - Wu , et al. | 2019-05-14 |
| Bump on Pad (BOP) Bonding Structure in Semiconductor Packaged Device App 20190123008 - Chuang; Yao-Chun ; et al. | 2019-04-25 |
| Bump on pad (BOP) bonding structure in semiconductor packaged device Grant 10,163,839 - Chuang , et al. Dec | 2018-12-25 |
| Method for manufacturing semiconductor package structure Grant 10,037,973 - Tseng , et al. July 31, 2 | 2018-07-31 |
| Packaging Assembly And Method Of Making The Same App 20180182724 - CHUANG; Chita ; et al. | 2018-06-28 |
| Bump structures in semiconductor device and packaging assembly Grant 9,905,524 - Chuang , et al. February 27, 2 | 2018-02-27 |
| Elongated Bump Structures in Package Structure App 20180047690 - Chuang; Yao-Chun ; et al. | 2018-02-15 |
| Metal routing architecture for integrated circuits Grant 9,881,885 - Kuo , et al. January 30, 2 | 2018-01-30 |
| Substrate Pad Structure App 20170345677 - Liu; Hao-Juin ; et al. | 2017-11-30 |
| Bump On Pad (bop) Bonding Structure In Semiconductor Packaged Device App 20170345783 - Chuang; Yao-Chun ; et al. | 2017-11-30 |
| Dummy Flip Chip Bumps for Reducing Stress App 20170309588 - Wu; Sheng-Yu ; et al. | 2017-10-26 |
| Elongated bump structures in package structure Grant 9,786,621 - Chuang , et al. October 10, 2 | 2017-10-10 |
| Bonded Structures for Package and Substrate App 20170271291 - Cha; Ming-Hong ; et al. | 2017-09-21 |
| Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device Grant 9,748,188 - Kuo , et al. August 29, 2 | 2017-08-29 |
| Connector Structure and Method of Forming Same App 20170243846 - Chen; Chen-Shien ; et al. | 2017-08-24 |
| Substrate pad structure Grant 9,741,589 - Liu , et al. August 22, 2 | 2017-08-22 |
| Dummy flip chip bumps for reducing stress Grant 9,711,477 - Wu , et al. July 18, 2 | 2017-07-18 |
| Bonded structures for package and substrate Grant 9,673,161 - Cha , et al. June 6, 2 | 2017-06-06 |
| Interconnection structure Grant 9,673,125 - Liu , et al. June 6, 2 | 2017-06-06 |
| Connector structure and method of forming same Grant 9,646,943 - Chen , et al. May 9, 2 | 2017-05-09 |
| Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods App 20170104356 - Yu; Chen-Hua ; et al. | 2017-04-13 |
| Method For Manufacturing Semiconductor Package Structure App 20160336298 - TSENG; HUA-WEI ; et al. | 2016-11-17 |
| Bonded Structures for Package and Substrate App 20160329293 - Cha; Ming-Hong ; et al. | 2016-11-10 |
| Scheme for connector site spacing and resulting structures Grant 9,472,521 - Chuang , et al. October 18, 2 | 2016-10-18 |
| Semiconductor package structure and manufacturing method thereof Grant 9,406,629 - Tseng , et al. August 2, 2 | 2016-08-02 |
| Bonded structures for package and substrate Grant 9,397,059 - Cha , et al. July 19, 2 | 2016-07-19 |
| Dummy Flip Chip Bumps for Reducing Stress App 20160181220 - Wu; Sheng-Yu ; et al. | 2016-06-23 |
| Stress Reduction Apparatus and Method App 20160155733 - Chuang; Yao-Chun ; et al. | 2016-06-02 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20160111384 - TSENG; HUA-WEI ; et al. | 2016-04-21 |
| Metal Routing Architecture for Integrated Circuits App 20160079192 - Kuo; Chen-Cheng ; et al. | 2016-03-17 |
| Dummy flip chip bumps for reducing stress Grant 9,287,234 - Wu , et al. March 15, 2 | 2016-03-15 |
| Semiconductor device package and method Grant 9,287,191 - Liu , et al. March 15, 2 | 2016-03-15 |
| Bump on Pad (BOP) Bonding Structure App 20160064347 - Kuo; Chen-Cheng ; et al. | 2016-03-03 |
| Semiconductor Device And Manufacturing Method Thereof App 20160064340 - TSENG; HUA-WEI ; et al. | 2016-03-03 |
| Stress reduction apparatus Grant 9,257,412 - Chuang , et al. February 9, 2 | 2016-02-09 |
| Elongated Bump Structures in Package Structure App 20160027752 - Chuang; Chita ; et al. | 2016-01-28 |
| Metal routing architecture for integrated circuits Grant 9,224,688 - Chuang , et al. December 29, 2 | 2015-12-29 |
| Bonded Structures for Package and Substrate App 20150371964 - Cha; Ming-Hong ; et al. | 2015-12-24 |
| Bump on pad (BOP) bonding structure Grant 9,196,573 - Chuang , et al. November 24, 2 | 2015-11-24 |
| Substrate Pad Structure App 20150318188 - Liu; Hao-Juin ; et al. | 2015-11-05 |
| Elongated bump structures in package structure Grant 9,159,695 - Chuang , et al. October 13, 2 | 2015-10-13 |
| Bonded structures for package and substrate Grant 9,123,788 - Cha , et al. September 1, 2 | 2015-09-01 |
| Substrate pad structure Grant 9,117,825 - Liu , et al. August 25, 2 | 2015-08-25 |
| Elongated bump structure for semiconductor devices Grant 9,093,332 - Kuo , et al. July 28, 2 | 2015-07-28 |
| Elongated bump structure in semiconductor device Grant 9,053,989 - Kuo , et al. June 9, 2 | 2015-06-09 |
| Bump interconnection techniques Grant 9,053,990 - Chuang , et al. June 9, 2 | 2015-06-09 |
| Packaging and function tests for package-on-package and system-in-package structures Grant 9,040,350 - Liu , et al. May 26, 2 | 2015-05-26 |
| Dummy Flip Chip Bumps for Reducing Stress App 20150004751 - Wu; Sheng-Yu ; et al. | 2015-01-01 |
| Bonded Structures for Package and Substrate App 20140377946 - Cha; Ming-Hong ; et al. | 2014-12-25 |
| Dummy flip chip bumps for reducing stress Grant 8,912,649 - Wu , et al. December 16, 2 | 2014-12-16 |
| Bonded structures for package and substrate Grant 8,829,673 - Cha , et al. September 9, 2 | 2014-09-09 |
| Packaging and Function Tests for Package-on-Package and System-in-Package Structures App 20140248722 - Liu; Hao-Juin ; et al. | 2014-09-04 |
| Elongated Bump Structures In Package Structure App 20140191391 - Chuang; Yao-Chun ; et al. | 2014-07-10 |
| Metal Routing Architecture for Integrated Circuits App 20140191390 - Chuang; Chita ; et al. | 2014-07-10 |
| Methods and apparatus for flip chip substrate with guard rings outside of a die attach region Grant 8,772,950 - Chuang , et al. July 8, 2 | 2014-07-08 |
| Packaging and function tests for package-on-package and system-in-package structures Grant 8,765,497 - Liu , et al. July 1, 2 | 2014-07-01 |
| Substrate Pad Structure App 20140159203 - Liu; Hao-Juin ; et al. | 2014-06-12 |
| Methods and Apparatus for Flip Chip Substrate with Guard Rings Outside of a Die Attach Region App 20140124947 - Chuang; Chita ; et al. | 2014-05-08 |
| Bump Interconnection Ratio for Robust CPI Window App 20140117532 - Chuang; Chita ; et al. | 2014-05-01 |
| Interconnection Structure App 20140117534 - Liu; Hao-Juin ; et al. | 2014-05-01 |
| Stress Reduction Apparatus App 20140070402 - Chuang; Yao-Chun ; et al. | 2014-03-13 |
| Metal pad structures in dies Grant 8,659,123 - Chuang , et al. February 25, 2 | 2014-02-25 |
| Bonded Structures for Package and Substrate App 20140048929 - Cha; Ming-Hong ; et al. | 2014-02-20 |
| Bump on Pad (BOP) Bonding structure App 20140035148 - Chuang; Yao-Chun ; et al. | 2014-02-06 |
| Reflow system and method for conductive connections Grant 8,623,756 - Chuang , et al. January 7, 2 | 2014-01-07 |
| Design Scheme for Connector Site Spacing and Resulting Structures App 20130320524 - Chuang; Yao-Chun ; et al. | 2013-12-05 |
| Semiconductor Device Package and Method App 20130093075 - Liu; Hao-Juin ; et al. | 2013-04-18 |
| Metal Pad Structures in Dies App 20130075872 - Chuang; Yao-Chun ; et al. | 2013-03-28 |
| Elongated Bump Structure In Semiconductor Device App 20130062755 - Kuo; Chen-Cheng ; et al. | 2013-03-14 |
| Packaging and Function Tests for Package-on-Package and System-in-Package Structures App 20130056872 - Liu; Hao-Juin ; et al. | 2013-03-07 |
| Dummy Flip Chip Bumps for Reducing Stress App 20130043583 - Wu; Sheng-Yu ; et al. | 2013-02-21 |
| Bump Structures In Semiconductor Device And Packaging Assembly App 20130026622 - CHUANG; Chita ; et al. | 2013-01-31 |
| Reflow System and Method for Conductive Connections App 20120329264 - Chuang; Chita ; et al. | 2012-12-27 |
| Elongated Bump Structure for Semiconductor Devices App 20120199966 - Kuo; Tin-Hao ; et al. | 2012-08-09 |
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