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Patent applications and USPTO patent grants for Chuang; Chin-Chang.The latest application filed is for "precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage".
Patent | Date |
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Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage Grant 8,101,703 - Wu , et al. January 24, 2 | 2012-01-24 |
Precursor Solution For Polyimide/silica Composite Material, Its Manufacture Method, And Polyimide/silica Composite Material Having Low Volume Shrinkage App 20100297455 - WU; Chung-Jen ;   et al. | 2010-11-25 |
Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage Grant 7,790,828 - Wu , et al. September 7, 2 | 2010-09-07 |
Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage App 20050245715 - Wu, Chung-Jen ;   et al. | 2005-11-03 |
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