Chuang; Chia-Che

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chuang; Chia-Che.The latest application filed is for "infrared absorption film, infrared absorption film manufacturing method and camera module comprising the infrared absorption film".

Company Profile

0.6.8

Chuang; Chia-Che - Kaohsiung TW
Chuang; Chia-Che - Tainan TW
Chuang, Chia-Che - Tainan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Infrared absorption film, infrared absorption film manufacturing method and camera module comprising the infrared absorption film Grant 9,321,224 - Chuang , et al. April 26, 2	2016-04-26
Infrared Absorption Film, Infrared Absorption Film Manufacturing Method And Camera Module Comprising The Infrared Absorption Film App 20160067932 - Chuang; Chia-Che ; et al.	2016-03-10
Plasticizable Heat-insulating Composition, Transparent Heat-insulating Intermediate Sheet And Transparent Heat-insulating Sandwich-structured Panel App 20140370263 - LU; Chen-Kuo ; et al.	2014-12-18
Method for pre-conditioning CMP polishing pad Grant 8,021,566 - Chuang , et al. September 20, 2	2011-09-20
Apparatus and method for pre-conditioning CMP polishing pad App 20060270237 - Chuang; Chia-Che ; et al.	2006-11-30
Apparatus for pre-conditioning CMP polishing pad Grant 7,105,446 - Chuang , et al. September 12, 2	2006-09-12
Copper CMP defect reduction by extra slurry polish App 20050106872 - Hong, William ; et al.	2005-05-19
Apparatus and method for pre-conditioning CMP polishing pad App 20050051266 - Chuang, Chia-Che ; et al.	2005-03-10
Method for forming a plug metal layer Grant 6,803,310 - Wang , et al. October 12, 2	2004-10-12
Method for forming a plug metal layer Grant 6,787,461 - Wang , et al. September 7, 2	2004-09-07
Method for forming a plug metal layer Grant 6,686,278 - Wang , et al. February 3, 2	2004-02-03
Method for forming a plug metal layer App 20030190802 - Wang, Yu-Piao ; et al.	2003-10-09
Method for forming a plug metal layer App 20030124787 - Wang, Yu-Piao ; et al.	2003-07-03
Method for forming a plug metal layer App 20020192953 - Wang, Yu-Piao ; et al.	2002-12-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.