Chuan; Koh Yong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chuan; Koh Yong.The latest application filed is for "copper on organic solderability preservative (osp) interconnect".
- Chuan; Koh Yong - Singapore SG
| Patent | Date |
|---|---|
| Multiple die stack package Grant 8,288,862 - Khiang , et al. October 16, 2 | 2012-10-16 |
| Copper On Organic Solderability Preservative (osp) Interconnect App 20090008796 - Eng; Kian Teng ; et al. | 2009-01-08 |
| Semiconductor package App 20030197284 - Khiang, Wang Chuen ; et al. | 2003-10-23 |
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