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Patent applications and USPTO patent grants for Chua; Yang Choo.The latest application filed is for "thermally conductive polyamide compounds containing laser direct structuring additives".
Patent | Date |
---|---|
Thermally conductive polyamide compounds containing laser direct structuring additives Grant 10,519,356 - Chua , et al. Dec | 2019-12-31 |
Thermally Conductive Polyamide Compounds Containing Laser Direct Structuring Additives App 20170066954 - CHUA; Yang Choo ;   et al. | 2017-03-09 |
Hybrid polymers Grant 8,853,330 - Leong , et al. October 7, 2 | 2014-10-07 |
Hybrid Polymers App 20140046005 - LEONG; Yew Wei ;   et al. | 2014-02-13 |
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