loadpatents
name:-0.01925802230835
name:-0.0074160099029541
name:-0.0087618827819824
Chu; Yung-Chi Patent Filings

Chu; Yung-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Yung-Chi.The latest application filed is for "semiconductor package and manufacturing method thereof".

Company Profile
8.7.17
  • Chu; Yung-Chi - Kaohsiung City TW
  • CHU; Yung-Chi - MIAOLI COUNTY TW
  • Chu; Yung-Chi - Kaohsiung TW
  • CHU; Yung-Chi - Zhunan Township TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package And Manufacturing Method Thereof
App 20220223490 - Chu; Yung-Chi ;   et al.
2022-07-14
Semiconductor Package And Manufacturing Method Thereof
App 20220216159 - Chu; Yung-Chi ;   et al.
2022-07-07
Method of Forming Semiconductor Device
App 20220208688 - Wang; Jhih-Yu ;   et al.
2022-06-30
Micro Led Display Device And Manufacturing Method Thereof
App 20220157789 - LAI; Yu-Hung ;   et al.
2022-05-19
Semiconductor package and manufacturing method thereof
Grant 11,289,426 - Chu , et al. March 29, 2
2022-03-29
Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region
Grant 11,289,396 - Chu , et al. March 29, 2
2022-03-29
Method of forming semiconductor device
Grant 11,276,647 - Wang , et al. March 15, 2
2022-03-15
Micro-led Display Device And Manufacturing Method Of The Same
App 20220068999 - LAI; Yu-Hung ;   et al.
2022-03-03
Package Structure And Method Of Manufacturing The Same
App 20220051978 - Chu; Yung-Chi ;   et al.
2022-02-17
Integrated Fan-out Package And Manufacturing Method Thereof
App 20210398942 - Wang; Jhih-Yu ;   et al.
2021-12-23
Sensor Package And Method
App 20210343638 - Chu; Yung-Chi ;   et al.
2021-11-04
Package structure and method of manufacturing the same
Grant 11,164,814 - Chu , et al. November 2, 2
2021-11-02
Package structure and method of manufacturing the same
Grant 11,164,839 - Chen , et al. November 2, 2
2021-11-02
Integrated fan-out package and manufacturing method thereof
Grant 11,114,407 - Wang , et al. September 7, 2
2021-09-07
Composition For Sacrificial Film, Package, Manufacturing Method Of Package
App 20210098321 - Chu; Yung-Chi ;   et al.
2021-04-01
Semiconductor Package And Manufacturing Method Thereof
App 20210098328 - Chu; Yung-Chi ;   et al.
2021-04-01
Package Structure And Method Of Manufacturing The Same
App 20200294915 - Chu; Yung-Chi ;   et al.
2020-09-17
Package Structure And Method Of Fabricating The Same
App 20200294930 - Wang; Jhih-Yu ;   et al.
2020-09-17
Method of Forming Semiconductor Device
App 20200227357 - Wang; Jhih-Yu ;   et al.
2020-07-16
Method of forming semiconductor device
Grant 10,607,941 - Wang , et al.
2020-03-31
Package Structure And Method Of Manufacturing The Same
App 20200083189 - Chen; Wei-Chih ;   et al.
2020-03-12
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190385975 - Wang; Jhih-Yu ;   et al.
2019-12-19
Semiconductor Package And Manufacturing Method Thereof
App 20190385951 - Chu; Yung-Chi ;   et al.
2019-12-19
Alignment Mark with Grating Patterns and Method Forming Same
App 20190333862 - Wang; Jhih-Yu ;   et al.
2019-10-31

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