loadpatents
Patent applications and USPTO patent grants for Chu; Yung-Chi.The latest application filed is for "semiconductor package and manufacturing method thereof".
Patent | Date |
---|---|
Semiconductor Package And Manufacturing Method Thereof App 20220223490 - Chu; Yung-Chi ;   et al. | 2022-07-14 |
Semiconductor Package And Manufacturing Method Thereof App 20220216159 - Chu; Yung-Chi ;   et al. | 2022-07-07 |
Method of Forming Semiconductor Device App 20220208688 - Wang; Jhih-Yu ;   et al. | 2022-06-30 |
Micro Led Display Device And Manufacturing Method Thereof App 20220157789 - LAI; Yu-Hung ;   et al. | 2022-05-19 |
Semiconductor package and manufacturing method thereof Grant 11,289,426 - Chu , et al. March 29, 2 | 2022-03-29 |
Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region Grant 11,289,396 - Chu , et al. March 29, 2 | 2022-03-29 |
Method of forming semiconductor device Grant 11,276,647 - Wang , et al. March 15, 2 | 2022-03-15 |
Micro-led Display Device And Manufacturing Method Of The Same App 20220068999 - LAI; Yu-Hung ;   et al. | 2022-03-03 |
Package Structure And Method Of Manufacturing The Same App 20220051978 - Chu; Yung-Chi ;   et al. | 2022-02-17 |
Integrated Fan-out Package And Manufacturing Method Thereof App 20210398942 - Wang; Jhih-Yu ;   et al. | 2021-12-23 |
Sensor Package And Method App 20210343638 - Chu; Yung-Chi ;   et al. | 2021-11-04 |
Package structure and method of manufacturing the same Grant 11,164,814 - Chu , et al. November 2, 2 | 2021-11-02 |
Package structure and method of manufacturing the same Grant 11,164,839 - Chen , et al. November 2, 2 | 2021-11-02 |
Integrated fan-out package and manufacturing method thereof Grant 11,114,407 - Wang , et al. September 7, 2 | 2021-09-07 |
Composition For Sacrificial Film, Package, Manufacturing Method Of Package App 20210098321 - Chu; Yung-Chi ;   et al. | 2021-04-01 |
Semiconductor Package And Manufacturing Method Thereof App 20210098328 - Chu; Yung-Chi ;   et al. | 2021-04-01 |
Package Structure And Method Of Manufacturing The Same App 20200294915 - Chu; Yung-Chi ;   et al. | 2020-09-17 |
Package Structure And Method Of Fabricating The Same App 20200294930 - Wang; Jhih-Yu ;   et al. | 2020-09-17 |
Method of Forming Semiconductor Device App 20200227357 - Wang; Jhih-Yu ;   et al. | 2020-07-16 |
Method of forming semiconductor device Grant 10,607,941 - Wang , et al. | 2020-03-31 |
Package Structure And Method Of Manufacturing The Same App 20200083189 - Chen; Wei-Chih ;   et al. | 2020-03-12 |
Integrated Fan-out Package And Manufacturing Method Thereof App 20190385975 - Wang; Jhih-Yu ;   et al. | 2019-12-19 |
Semiconductor Package And Manufacturing Method Thereof App 20190385951 - Chu; Yung-Chi ;   et al. | 2019-12-19 |
Alignment Mark with Grating Patterns and Method Forming Same App 20190333862 - Wang; Jhih-Yu ;   et al. | 2019-10-31 |
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