Chu; Yong Cheol
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Yong Cheol.The latest application filed is for "metal core solder ball and heat dissipation structure for semiconductor device using the same".
- Chu; Yong Cheol - Ulsan KR
- Chu; Yong Cheol - Jung-gu KR
| Patent | Date |
|---|---|
| Metal core solder ball and heat dissipation structure for semiconductor device using the same Grant 10,661,394 - Chu , et al. | 2020-05-26 |
| Metal Core Solder Ball And Heat Dissipation Structure For Semiconductor Device Using The Same App 20140183733 - CHU; Yong Cheol ; et al. | 2014-07-03 |
| Solder Ink And Electronic Device Package Using Same App 20120309866 - Jang; Yong Un ; et al. | 2012-12-06 |
| Conductive Adhesive, Method For Manufacturing The Same, And Electronic Device Including The Same App 20120228560 - Jang; Yong Un ; et al. | 2012-09-13 |
| Lead free solder alloy Grant 8,221,560 - Kim , et al. July 17, 2 | 2012-07-17 |
| Solder Adhesive And A Production Method For The Same, And An Electronic Device Comprising The Same App 20120067629 - Jang; Yong Un ; et al. | 2012-03-22 |
| Lead Free Solder Alloy And Manufacturing Method Thereof App 20100272598 - Kim; Kang Hee ; et al. | 2010-10-28 |
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