Chu; Yen-Lin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Yen-Lin.The latest application filed is for "heat dissipation device with multiple heat dissipation zones".
- Chu; Yen-Lin - New Taipei City TW
- Chu; Yen-Lin - New Taipei TW
- Chu; Yen-Lin - Sinjhuang TW
- Chu; Yen-Lin - Sinjhuang City Taipei
- Chu; Yen-Lin - Taipei TW
| Patent | Date |
|---|---|
| Heat Dissipation Device With Multiple Heat Dissipation Zones App 20220141994 - Lin; Sheng-Huang ; et al. | 2022-05-05 |
| Heat Dissipation Structure Of Electronic Device App 20200068745 - Lin; Sheng-Huang ; et al. | 2020-02-27 |
| Thermal module assembling structure Grant 10,021,813 - Lin , et al. July 10, 2 | 2018-07-10 |
| Method of manufacturing a heat dissipation device Grant 9,625,218 - Lin , et al. April 18, 2 | 2017-04-18 |
| Thermal Module Assembling Structure App 20170105316 - Lin; Yuan-Yi ; et al. | 2017-04-13 |
| Mounting bracket for heat dissipation device having fins Grant 9,574,830 - Lin , et al. February 21, 2 | 2017-02-21 |
| Heat Dissipation Device And Method Of Manufacturing Same App 20150122456 - Lin; Sheng-Huang ; et al. | 2015-05-07 |
| Thermal module mount structure Grant 8,931,972 - Chu January 13, 2 | 2015-01-13 |
| Heat Dissipation Device And Method Of Manufacturing Same App 20130248145 - Lin; Sheng-Huang ; et al. | 2013-09-26 |
| Thermal Module Mount Structure App 20110030919 - Chu; Yen-Lin | 2011-02-10 |
| Partition structure of a computer casing Grant 6,998,534 - Chu February 14, 2 | 2006-02-14 |
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