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name:-0.0058109760284424
name:-0.0030088424682617
CHU; WENG-CHU Patent Filings

CHU; WENG-CHU

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHU; WENG-CHU.The latest application filed is for "ink container for photo-curable ink".

Company Profile
1.7.7
  • CHU; WENG-CHU - HSINCHU CITY TW
  • Chu; Weng-Chu - Qionglin Shiang TW
  • Chu; Weng-Chu - Hsinchu County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ink Container For Photo-curable Ink
App 20190143705 - LU; YI-CHING ;   et al.
2019-05-16
Coupling well structure for improving HVMOS performance
Grant 9,111,957 - Chou , et al. August 18, 2
2015-08-18
Coupling Well Structure for Improving HVMOS Performance
App 20140045304 - Chou; Hsueh-Liang ;   et al.
2014-02-13
Coupling well structure for improving HVMOS performance
Grant 8,592,923 - Chou , et al. November 26, 2
2013-11-26
Coupling Well Structure for Improving HVMOS Performance
App 20120037987 - Chou; Hsueh-Liang ;   et al.
2012-02-16
Coupling well structure for improving HVMOS performance
Grant 8,049,295 - Chou , et al. November 1, 2
2011-11-01
Lens modules and fabrication methods thereof
Grant 8,000,041 - Lin , et al. August 16, 2
2011-08-16
Structures of high-voltage MOS devices with improved electrical performance
Grant 7,888,767 - Huang , et al. February 15, 2
2011-02-15
Coupling Well Structure for Improving HVMOS Performance
App 20110006366 - Chou; Hsueh-Liang ;   et al.
2011-01-13
Coupling well structure for improving HVMOS performance
Grant 7,816,214 - Chou , et al. October 19, 2
2010-10-19
Coupling Well Structure for Improving HVMOS Performance
App 20090142898 - Chou; Hsueh-Liang ;   et al.
2009-06-04
Coupling well structure for improving HVMOS performance
App 20080211026 - Chou; Hsueh-Liang ;   et al.
2008-09-04
Structures of high-voltage MOS devices with improved electrical performance
App 20080017948 - Huang; Kun-Ming ;   et al.
2008-01-24

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