Chu; Weibing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Weibing.The latest application filed is for "method of manufacturing a semiconductor device package with a heatsink".
- Chu; Weibing - Shanghai CN
| Patent | Date |
|---|---|
| Method Of Manufacturing A Semiconductor Device Package With A Heatsink App 20130017652 - Tsui; Anthony C. ; et al. | 2013-01-17 |
| Semiconductor Device Package Having Features Formed By Stamping App 20130009296 - Tsui; Anthony C. ; et al. | 2013-01-10 |
| Semiconductor Device Package Having Configurable Lead Frame Fingers App 20130009297 - Tsui; Anthony C. ; et al. | 2013-01-10 |
| Semiconductor Device Package With Two Component Lead Frame App 20120181677 - Tsui; Anthony C. ; et al. | 2012-07-19 |
| Power Semiconductor Device Packaging App 20120181676 - Tsui; Anthony C. ; et al. | 2012-07-19 |
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