Chu; Tsung Yao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Tsung Yao.The latest application filed is for "bonding pad and method for manufacturing it".

Company Profile

0.7.2

Chu; Tsung Yao - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding pad and method for manufacturing it Grant 6,566,752 - Hsia , et al. May 20, 2	2003-05-20
Bonding pad and method for manufacturing it App 20020149115 - Hsia, Chin Chiu ; et al.	2002-10-17
Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer Grant 6,459,150 - Wu , et al. October 1, 2	2002-10-01
Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication Grant 6,433,427 - Wu , et al. August 13, 2	2002-08-13
Bonding pad and method for manufacturing it Grant 6,426,555 - Hsia , et al. July 30, 2	2002-07-30
Wafer Level Package Incorporating Dual Stress Buffer Layers For I/o Redistribution App 20020093107 - Wu, Enboa ; et al.	2002-07-18
Integrated process for I/O redistribution and passive components fabrication and devices formed Grant 6,365,498 - Chu , et al. April 2, 2	2002-04-02
Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated Grant 6,312,974 - Wu , et al. November 6, 2	2001-11-06
Wafer level packaging method and devices formed Grant 6,197,613 - Kung , et al. March 6, 2	2001-03-06

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