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name:-0.0059421062469482
name:-0.0055108070373535
name:-0.00099706649780273
Chu; Tsui Ping Patent Filings

Chu; Tsui Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Tsui Ping.The latest application filed is for "mos device assembly".

Company Profile
0.10.8
  • Chu; Tsui Ping - Kuching CN
  • Chu; Tsui Ping - Sarawak N/A MY
  • Chu; Tsui Ping - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
MOS device assembly
Grant 10,026,734 - Toner , et al. July 17, 2
2018-07-17
Capacitor structures for semiconductor device
Grant 9,793,338 - Chu , et al. October 17, 2
2017-10-17
Reduction of fluorine contamination of bond pads of semiconductor devices
Grant 9,059,110 - Yook , et al. June 16, 2
2015-06-16
Mos Device Assembly
App 20140367796 - Toner; Brendan ;   et al.
2014-12-18
Semiconductor device comprising a metal system including a separate inductor metal layer
Grant 8,736,021 - Chu , et al. May 27, 2
2014-05-27
Capacitor Structures For Semiconductor Device
App 20130140677 - Chu; Tsui Ping ;   et al.
2013-06-06
Reduction Of Fluorine Contamination Of Bond Pads Of Semiconductor Devices
App 20120241914 - Yook; Hyung Sun ;   et al.
2012-09-27
Semiconductor Device Comprising a Metal System Including a Separate Inductor Metal Layer
App 20120068303 - Chu; Tsui Ping ;   et al.
2012-03-22
Method and apparatus for identifying high metal content on a semiconductor surface
Grant 6,759,857 - Kong , et al. July 6, 2
2004-07-06
Method and apparatus for identifying high metal content on a semiconductor surface
Grant 6,633,170 - Kong , et al. October 14, 2
2003-10-14
Methods to prevent metal deposited wafers from contaminating the front-end cleaning sinks or front end furnaces
App 20030042915 - Kong, Sik On ;   et al.
2003-03-06
Methods to prevent metal deposited wafers from contaminating the front-end cleaning sinks or front end furnaces
App 20030038642 - Kong, Sik On ;   et al.
2003-02-27

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