Chu; Te-Fang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Te-Fang.The latest application filed is for "electronic package, supporting structure and fabrication method thereof".

Company Profile

1.5.9

Chu; Te-Fang - Taichung TW
Chu; Te-Fang - Tantzu TW
Chu; Te-Fang - Taichung Hsien TW
Chu; Te-Fang - Nantou County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Package, Supporting Structure And Fabrication Method Thereof App 20210305148 - Chang; Cho-Hsin ; et al.	2021-09-30
Method for fabricating electronic package Grant 10,566,320 - Shih , et al. Feb	2020-02-18
Method For Fabricating Electronic Package App 20190115330 - Shih; Chi-Liang ; et al.	2019-04-18
Electronic package and fabrication method thereof Grant 10,181,458 - Shih , et al. Ja	2019-01-15
Electronic Package And Fabrication Method Thereof App 20170040304 - Shih; Chi-Liang ; et al.	2017-02-09
Package structure and fabrication method thereof Grant 9,526,171 - Shih , et al. December 20, 2	2016-12-20
Semiconductor package with shielding member and method of manufacturing the same Grant 9,490,219 - Chang , et al. November 8, 2	2016-11-08
Semiconductor package and fabrication method thereof Grant 9,343,401 - Shih , et al. May 17, 2	2016-05-17
Package Structure And Fabrication Method Thereof App 20150366085 - Shih; Chi-Liang ; et al.	2015-12-17
Semiconductor Package And Method Of Manufacturing The Same App 20150333017 - Chang; Cho-Hsin ; et al.	2015-11-19
Semiconductor Package And Fabrication Method Thereof App 20150243574 - Shih; Chi-Liang ; et al.	2015-08-27
Semiconductor Package, Fabrication Method Thereof And Molding Compound App 20140264958 - Hsu; Tsung-Hsien ; et al.	2014-09-18
Electronic Package, Fabrication Method Thereof And Adhesive Compound App 20140203771 - Hsu; Tsung-Hsien ; et al.	2014-07-24
Electronic Assembly and Method for Making Electronic Devices App 20090251878 - Hsu; Tsung-Hsien ; et al.	2009-10-08

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