loadpatents
name:-0.0049700736999512
name:-0.0089340209960938
name:-0.0003809928894043
Chu; Sung G. Patent Filings

Chu; Sung G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Sung G..The latest application filed is for "non-hydrocarbyl hydrophobically modified polycarboxylic polymers".

Company Profile
0.9.3
  • Chu; Sung G. - Hockessin DE US
  • Chu; Sung G. - Wilmington DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Non-hydrocarbyl hydrophobically modified polycarboxylic polymers
Grant 8,623,977 - Chu , et al. January 7, 2
2014-01-07
Non-hydrocarbyl Hydrophobically Modified Polycarboxylic Polymers
App 20100130711 - CHU; Sung G. ;   et al.
2010-05-27
Paper coatings containing hydroxyethylcellulose rheology modifier and high levels of calcium carbonate pigment
App 20080075964 - Burdick; Charles L. ;   et al.
2008-03-27
Superplasticizer for concrete and self-leveling compounds
App 20030144384 - Chen, Fu ;   et al.
2003-07-31
Flexural bond strength/low air/workability additive for mortar cement
Grant 6,068,696 - Anttila , et al. May 30, 2
2000-05-30
Thermosettable resin compositions
Grant 5,095,074 - Chu , et al. March 10, 1
1992-03-10
Polyindanes as processing aid for engineering thermoplastics
Grant 5,049,615 - Chu , et al. September 17, 1
1991-09-17
Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom
Grant 4,946,908 - Chu , et al. August 7, 1
1990-08-07
Thermosetting epoxy resin compositions and thermosets therefrom
Grant 4,822,832 - Chu , et al. April 18, 1
1989-04-18
Epoxy thermosets having improved toughness
Grant 4,656,207 - Jabloner , et al. April 7, 1
1987-04-07
Thermosetting epoxy resin compositions and thermosets therefrom
Grant 4,656,208 - Chu , et al. April 7, 1
1987-04-07

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