Chu; Rei-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Rei-Lin.The latest application filed is for "method of optimizing film deposition process in semiconductor fabrication by using gas sensor".

Company Profile

2.4.8

Chu; Rei-Lin - Hsinchu TW
CHU; Rei-Lin - Hsinchu City TW
Chu; Rei-Lin - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
MIM capacitor with a symmetrical capacitor insulator structure Grant 11,430,729 - Lin , et al. August 30, 2	2022-08-30
Method Of Optimizing Film Deposition Process In Semiconductor Fabrication By Using Gas Sensor App 20220139695 - CHU; Rei-Lin ; et al.	2022-05-05
Enhanced Trench Isolation Structure App 20220123031 - Tsai; Min-Ying ; et al.	2022-04-21
3d Trench Capacitor For Integrated Passive Devices App 20220115358 - Huang; Xin-Hua ; et al.	2022-04-14
Mim Capacitor With A Symmetrical Capacitor Insulator Structure App 20220084935 - Lin; Hsing-Lien ; et al.	2022-03-17
Method To Reduce Breakdown Failure In A Mim Capacitor App 20220069068 - Lin; Hsing-Lien ; et al.	2022-03-03
Method of optimizing film deposition process in semiconductor fabrication by using gas sensor Grant 11,232,946 - Chu , et al. January 25, 2	2022-01-25
3D trench capacitor for integrated passive devices Grant 11,211,362 - Huang , et al. December 28, 2	2021-12-28
Method to reduce breakdown failure in a MIM capacitor Grant 11,152,455 - Lin , et al. October 19, 2	2021-10-19
3d Trench Capacitor For Integrated Passive Devices App 20210296283 - Huang; Xin-Hua ; et al.	2021-09-23
Method Of Optimizing Film Deposition Process In Semiconductor Fabrication App 20210249255 - CHU; Rei-Lin ; et al.	2021-08-12
Method To Reduce Breakdown Failure In A Mim Capacitor App 20210091169 - Lin; Hsing-Lien ; et al.	2021-03-25

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