Chu; Pinlei Edmund

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Pinlei Edmund.The latest application filed is for "semiconductor device cleaning solution, method of use, and method of manufacture".

Company Profile

8.6.7

Chu; Pinlei Edmund - Hsinchu TW
CHU; Pinlei Edmund - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices formed using multiple planarization processes Grant 11,121,028 - Hsu , et al. September 14, 2	2021-09-14
Method for reducing metal plug corrosion and device Grant 11,114,339 - Nieh , et al. September 7, 2	2021-09-07
Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture App 20210163859 - Chu; Pinlei Edmund ; et al.	2021-06-03
Semiconductor device cleaning solution, method of use, and method of manufacture Grant 10,961,487 - Chu , et al. March 30, 2	2021-03-30
Methods of forming semiconductor devices using multiple planarization processes Grant 10,636,701 - Hsu , et al.	2020-04-28
Method for Reducing Metal Plug Corrosion and Device App 20200090997 - Nieh; Ling-Fu ; et al.	2020-03-19
Semiconductor Devices Formed Using Multiple Planarization Processes App 20200006125 - Hsu; Chun-Wei ; et al.	2020-01-02
Method for reducing metal plug corrosion and device Grant 10,510,601 - Nieh , et al. Dec	2019-12-17
Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture App 20190161711 - Chu; Pinlei Edmund ; et al.	2019-05-30
Semiconductor Devices and Methods of Forming App 20190103308 - Hsu; Chun-Wei ; et al.	2019-04-04
Method for Reducing Metal Plug Corrosion and Device App 20190096761 - Nieh; Ling-Fu ; et al.	2019-03-28
Method for forming semiconductor structure using polishing process Grant 10,157,781 - Hsu , et al. Dec	2018-12-18
Method For Forming Semiconductor Structure Using Polishing Process App 20180166331 - HSU; Chun-Wei ; et al.	2018-06-14

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