Chu; Mei-Ling
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Mei-Ling.The latest application filed is for "epoxy resin composition, and prepreg and printed circuit board usng the same".
- Chu; Mei-Ling - Chupei N/A TW
- CHU; Mei Ling - Hsinchu Hsien TW
- Chu; Mei-Ling - Chupei City TW
- Chu; Mei-Ling - Hsinchu TW
| Patent | Date |
|---|---|
| Resin composition and uses of the same Grant 8,734,950 - Chen , et al. May 27, 2 | 2014-05-27 |
| Epoxy Resin Composition, And Prepreg And Printed Circuit Board Usng The Same App 20130306357 - HSU; Hsuan Hao ; et al. | 2013-11-21 |
| Resin Composition And Uses Of The Same App 20120263955 - Chen; Hsien-Te ; et al. | 2012-10-18 |
| Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same App 20120024580 - HSU; Hsuan Hao ; et al. | 2012-02-02 |
| Method and system for estimating microelectronic fabrication product yield Grant 6,909,931 - Liao , et al. June 21, 2 | 2005-06-21 |
| Method and system for estimating microelectronic fabrication product yield App 20030225475 - Liao, Yun-Wei ; et al. | 2003-12-04 |
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