loadpatents
Patent applications and USPTO patent grants for Chu; Li-Huan.The latest application filed is for "semiconductor package and manufacturing process thereof".
Patent | Date |
---|---|
Semiconductor Package And Manufacturing Process Thereof App 20220246511 - Chu; Li-Huan ;   et al. | 2022-08-04 |
Magnetic shielding material with insulator-coated ferromagnetic particles Grant 11,404,383 - Lu , et al. August 2, 2 | 2022-08-02 |
Semiconductor packages with crack preventing structure Grant 11,342,291 - Chuang , et al. May 24, 2 | 2022-05-24 |
Semiconductor package and manufacturing process thereof Grant 11,315,860 - Chu , et al. April 26, 2 | 2022-04-26 |
Carrier Tape System And Components And Methods Of Use App 20220110232 - CHIU; Sung-Sheng ;   et al. | 2022-04-07 |
Semiconductor structure and manufacturing method thereof Grant 11,239,143 - Tsao , et al. February 1, 2 | 2022-02-01 |
Carrier tape system and components and methods of use Grant 11,240,947 - Chiu , et al. February 1, 2 | 2022-02-01 |
Dicing Method for Stacked Semiconductor Devices App 20210358808 - Lu; Tsung-Hsing ;   et al. | 2021-11-18 |
Integrated Fan-out Structures And Methods For Forming The Same App 20210343667 - CHEN; Tsui-Mei ;   et al. | 2021-11-04 |
Semiconductor device with bump structure and method of making semiconductor device Grant 11,127,704 - Tsao , et al. September 21, 2 | 2021-09-21 |
Package and printed circuit board attachment Grant 11,101,190 - Tsao , et al. August 24, 2 | 2021-08-24 |
Dicing method for stacked semiconductor devices Grant 11,081,392 - Lu , et al. August 3, 2 | 2021-08-03 |
Semiconductor Package And Manufacturing Process Thereof App 20210118789 - Chu; Li-Huan ;   et al. | 2021-04-22 |
Package and Printed Circuit Board Attachment App 20210098327 - Tsao; Pei-Haw ;   et al. | 2021-04-01 |
Magnetic Shielding Material With Insulator-coated Ferromagnetic Particles App 20210035920 - LU; Tsung-Hsing ;   et al. | 2021-02-04 |
Printed circuit board Grant 10,912,194 - Tsao , et al. February 2, 2 | 2021-02-02 |
Magnetic shielding material with insulator-coated ferromagnetic particles Grant 10,892,230 - Lu , et al. January 12, 2 | 2021-01-12 |
Package and printed circuit board attachment Grant 10,867,881 - Tsao , et al. December 15, 2 | 2020-12-15 |
Semiconductor Packages With Crack Preventing Structure App 20200357760 - CHUANG; Yao-Chun ;   et al. | 2020-11-12 |
Package structure with protrusion structure Grant 10,692,828 - Tsao , et al. | 2020-06-23 |
Dicing Method for Stacked Semiconductor Devices App 20200105600 - Lu; Tsung-Hsing ;   et al. | 2020-04-02 |
Semiconductor Structure And Manufacturing Method Thereof App 20200098677 - TSAO; PEI-HAW ;   et al. | 2020-03-26 |
Package and Printed Circuit Board Attachment App 20200083130 - Tsao; Pei-Haw ;   et al. | 2020-03-12 |
Printed Circuit Board App 20200077515 - TSAO; Pei-Haw ;   et al. | 2020-03-05 |
Magnetic Shielding Material With Insulator-coated Ferromagnetic Particles App 20200035615 - LU; Tsung-Hsing ;   et al. | 2020-01-30 |
Package And Printed Circuit Board Attachment App 20200020603 - TSAO; Pei-Haw ;   et al. | 2020-01-16 |
Carrier Tape System And Components And Methods Of Use App 20200008330 - CHIU; Sung-Sheng ;   et al. | 2020-01-02 |
Package and printed circuit board attachment Grant 10,510,633 - Tsao , et al. Dec | 2019-12-17 |
Printed circuit board Grant 10,506,712 - Tsao , et al. Dec | 2019-12-10 |
Semiconductor structure and manufacturing method thereof Grant 10,373,901 - Tsao , et al. | 2019-08-06 |
Semiconductor Device With Bump Structure And Method Of Making Semiconductor Device App 20190164920 - TSAO; Pei-Haw ;   et al. | 2019-05-30 |
Package Structure With Protrusion Structure App 20190148317 - TSAO; Pei-Haw ;   et al. | 2019-05-16 |
Wafer structure and packaging method Grant 10,283,424 - Chen , et al. | 2019-05-07 |
Package structure with protrusion structure Grant 10,163,827 - Tsao , et al. Dec | 2018-12-25 |
CIGS solar cell structure and method for fabricating the same Grant 9,018,032 - Yang , et al. April 28, 2 | 2015-04-28 |
High Efficiency Photovoltaic System App 20150000723 - CHENG; Tzu-Huan ;   et al. | 2015-01-01 |
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