loadpatents
name:-0.021018028259277
name:-0.01903510093689
name:-0.014321088790894
Chu; Li-Huan Patent Filings

Chu; Li-Huan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Li-Huan.The latest application filed is for "semiconductor package and manufacturing process thereof".

Company Profile
13.19.18
  • Chu; Li-Huan - Hsinchu TW
  • Chu; Li-Huan - Hsin Chu TW
  • CHU; Li-Huan - Hsin Chu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package And Manufacturing Process Thereof
App 20220246511 - Chu; Li-Huan ;   et al.
2022-08-04
Magnetic shielding material with insulator-coated ferromagnetic particles
Grant 11,404,383 - Lu , et al. August 2, 2
2022-08-02
Semiconductor packages with crack preventing structure
Grant 11,342,291 - Chuang , et al. May 24, 2
2022-05-24
Semiconductor package and manufacturing process thereof
Grant 11,315,860 - Chu , et al. April 26, 2
2022-04-26
Carrier Tape System And Components And Methods Of Use
App 20220110232 - CHIU; Sung-Sheng ;   et al.
2022-04-07
Semiconductor structure and manufacturing method thereof
Grant 11,239,143 - Tsao , et al. February 1, 2
2022-02-01
Carrier tape system and components and methods of use
Grant 11,240,947 - Chiu , et al. February 1, 2
2022-02-01
Dicing Method for Stacked Semiconductor Devices
App 20210358808 - Lu; Tsung-Hsing ;   et al.
2021-11-18
Integrated Fan-out Structures And Methods For Forming The Same
App 20210343667 - CHEN; Tsui-Mei ;   et al.
2021-11-04
Semiconductor device with bump structure and method of making semiconductor device
Grant 11,127,704 - Tsao , et al. September 21, 2
2021-09-21
Package and printed circuit board attachment
Grant 11,101,190 - Tsao , et al. August 24, 2
2021-08-24
Dicing method for stacked semiconductor devices
Grant 11,081,392 - Lu , et al. August 3, 2
2021-08-03
Semiconductor Package And Manufacturing Process Thereof
App 20210118789 - Chu; Li-Huan ;   et al.
2021-04-22
Package and Printed Circuit Board Attachment
App 20210098327 - Tsao; Pei-Haw ;   et al.
2021-04-01
Magnetic Shielding Material With Insulator-coated Ferromagnetic Particles
App 20210035920 - LU; Tsung-Hsing ;   et al.
2021-02-04
Printed circuit board
Grant 10,912,194 - Tsao , et al. February 2, 2
2021-02-02
Magnetic shielding material with insulator-coated ferromagnetic particles
Grant 10,892,230 - Lu , et al. January 12, 2
2021-01-12
Package and printed circuit board attachment
Grant 10,867,881 - Tsao , et al. December 15, 2
2020-12-15
Semiconductor Packages With Crack Preventing Structure
App 20200357760 - CHUANG; Yao-Chun ;   et al.
2020-11-12
Package structure with protrusion structure
Grant 10,692,828 - Tsao , et al.
2020-06-23
Dicing Method for Stacked Semiconductor Devices
App 20200105600 - Lu; Tsung-Hsing ;   et al.
2020-04-02
Semiconductor Structure And Manufacturing Method Thereof
App 20200098677 - TSAO; PEI-HAW ;   et al.
2020-03-26
Package and Printed Circuit Board Attachment
App 20200083130 - Tsao; Pei-Haw ;   et al.
2020-03-12
Printed Circuit Board
App 20200077515 - TSAO; Pei-Haw ;   et al.
2020-03-05
Magnetic Shielding Material With Insulator-coated Ferromagnetic Particles
App 20200035615 - LU; Tsung-Hsing ;   et al.
2020-01-30
Package And Printed Circuit Board Attachment
App 20200020603 - TSAO; Pei-Haw ;   et al.
2020-01-16
Carrier Tape System And Components And Methods Of Use
App 20200008330 - CHIU; Sung-Sheng ;   et al.
2020-01-02
Package and printed circuit board attachment
Grant 10,510,633 - Tsao , et al. Dec
2019-12-17
Printed circuit board
Grant 10,506,712 - Tsao , et al. Dec
2019-12-10
Semiconductor structure and manufacturing method thereof
Grant 10,373,901 - Tsao , et al.
2019-08-06
Semiconductor Device With Bump Structure And Method Of Making Semiconductor Device
App 20190164920 - TSAO; Pei-Haw ;   et al.
2019-05-30
Package Structure With Protrusion Structure
App 20190148317 - TSAO; Pei-Haw ;   et al.
2019-05-16
Wafer structure and packaging method
Grant 10,283,424 - Chen , et al.
2019-05-07
Package structure with protrusion structure
Grant 10,163,827 - Tsao , et al. Dec
2018-12-25
CIGS solar cell structure and method for fabricating the same
Grant 9,018,032 - Yang , et al. April 28, 2
2015-04-28
High Efficiency Photovoltaic System
App 20150000723 - CHENG; Tzu-Huan ;   et al.
2015-01-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed