Chu; Jia-Ni
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Jia-Ni.The latest application filed is for "abrasive particles for chemical mechanical polishing".
- Chu; Jia-Ni - Wilmington DE US
| Patent | Date |
|---|---|
| Abrasive Particles for Chemical Mechanical Polishing App 20150114928 - Chu; Jia-Ni ; et al. | 2015-04-30 |
| Abrasive Particles for Chemical Mechanical Polishing App 20130000214 - Chu; Jia-Ni ; et al. | 2013-01-03 |
| Abrasive partilcle for chemical mechanical polishing App 20060175295 - Chu; Jia-Ni ; et al. | 2006-08-10 |
| Thermoplastic adsorbent compositions containing wax and insulating glass units containing such compositions Grant 6,777,481 - Chu August 17, 2 | 2004-08-17 |
| Thermoplastic adsorbent compositions containing wax and insulating glass units containing such compositions App 20010027229 - Chu, Jia-Ni | 2001-10-04 |
| Non-reclosable packages containing desiccant matrix Grant 6,112,888 - Sauro , et al. September 5, 2 | 2000-09-05 |
| Desiccation using polymer-bound desiccant beads Grant 5,879,764 - Chu , et al. March 9, 1 | 1999-03-09 |
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