loadpatents
Patent applications and USPTO patent grants for Chu; Hung-Chun.The latest application filed is for "heat dissipation plate, gap adjusting jig for heat dissipation and motherboard".
Patent | Date |
---|---|
Heat dissipation module and detachable expansion card using the same Grant 7,852,632 - Chu , et al. December 14, 2 | 2010-12-14 |
Heat Dissipation Plate, Gap Adjusting Jig For Heat Dissipation And Motherboard App 20090190303 - Chu; Hung-Chun ;   et al. | 2009-07-30 |
Heat sink backplate module, circuit board, and electronic apparatus having the same Grant 7,508,667 - Wu , et al. March 24, 2 | 2009-03-24 |
Heat Dissipation Module And Detachable Expansion Card Using The Same App 20090040722 - Chu; Hung-Chun ;   et al. | 2009-02-12 |
Electronic device Grant 7,436,667 - Wu , et al. October 14, 2 | 2008-10-14 |
Heat Sink Backplate Module, Circuit Board, And Electronic Apparatus Having The Same App 20080123295 - Wu; Chun-Chieh ;   et al. | 2008-05-29 |
Electronic Device Having Heat Spreader App 20080024993 - Chu; Hung-Chun ;   et al. | 2008-01-31 |
Cooling apparatus and system thereof App 20070289719 - Chu; Hung-Chun ;   et al. | 2007-12-20 |
Electronic device App 20070268670 - Chu; Hung-Chun ;   et al. | 2007-11-22 |
Electronic device App 20070217156 - Wu; Chun-Chieh ;   et al. | 2007-09-20 |
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