Chu; Hui-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Hui-Chen.The latest application filed is for "protecting t-contacts of chip scale packages from moisture".
- Chu; Hui-Chen - Hsin-Chu N/A TW
- Chu; Hui-Chen - Kao-Hsiung TW
- Chu; Hui-Chen - Kao-Hsuing County TW
- Chu; Hui-Chen - San- Min Area Kaohsiung TW
| Patent | Date |
|---|---|
| Protecting T-contacts of chip scale packages from moisture Grant 8,507,316 - Chu , et al. August 13, 2 | 2013-08-13 |
| Protecting T-Contacts of Chip Scale Packages from Moisture App 20120161308 - Chu; Hui-Chen ; et al. | 2012-06-28 |
| Method and system for synchronizing control limit and equipment performance Grant 6,947,801 - Lin , et al. September 20, 2 | 2005-09-20 |
| Method and system for synchronizing control limit and equipment performance App 20050038543 - Lin, Shui-Tien ; et al. | 2005-02-17 |
| Multi-layer spacer technology for flash EEPROM Grant 6,624,465 - Chien , et al. September 23, 2 | 2003-09-23 |
| Plasma etch method with attenuated patterned layer charging Grant 6,303,510 - Chien , et al. October 16, 2 | 2001-10-16 |
| Method of manufacturing CMOS image sensor leakage free with double layer spacer Grant 6,071,826 - Cho , et al. June 6, 2 | 2000-06-06 |
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