CHU; Hsien-Shih
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHU; Hsien-Shih.The latest application filed is for "method of fabricating semiconductor device".
- CHU; Hsien-Shih - Kaohsiung City TW
- Chu; Hsien-Shih - Fujian CN
- Chu; Hsien-Shih - Kaohsiung TW
| Patent | Date |
|---|---|
| Method Of Fabricating Semiconductor Device App 20220013528 - HE; Shi-Wei ; et al. | 2022-01-13 |
| Semiconductor Structure And Method Of Forming Same App 20210399092 - TUNG; Yu-Cheng ; et al. | 2021-12-23 |
| Semiconductor device having void in bit line contact plug Grant 11,164,877 - He , et al. November 2, 2 | 2021-11-02 |
| Semiconductor structure and method of forming same Grant 11,145,715 - Tung , et al. October 12, 2 | 2021-10-12 |
| Semiconductor Device, Method Of Fabricating Same And Memory App 20210082923 - HE; Shi-Wei ; et al. | 2021-03-18 |
| Semiconductor Structure And Method Of Forming Same App 20210020742 - TUNG; Yu-Cheng ; et al. | 2021-01-21 |
| Patterning method Grant 10,475,649 - Chuang , et al. Nov | 2019-11-12 |
| Patterning Method App 20190318929 - Chuang; Yu-Chen ; et al. | 2019-10-17 |
| Method of fabricating a mask Grant 10,304,679 - Chen , et al. | 2019-05-28 |
| Method for forming buried word lines Grant 10,249,629 - Chen , et al. | 2019-04-02 |
| Method of fabricating isolation structure Grant 10,199,258 - Chen , et al. Fe | 2019-02-05 |
| Method of fabricating STI trench Grant 10,192,777 - Chu , et al. Ja | 2019-01-29 |
| Semiconductor storage device and manufacturing method thereof Grant 10,062,700 - Chang , et al. August 28, 2 | 2018-08-28 |
| Method Of Fabricating A Mask App 20180226250 - Chen; Chieh-Te ; et al. | 2018-08-09 |
| Method of fabricating mask pattern Grant 10,032,631 - Chen , et al. July 24, 2 | 2018-07-24 |
| Method Of Fabricating Sti Trench App 20180190538 - Chu; Hsien-Shih ; et al. | 2018-07-05 |
| Semiconductor storage device and manufacturing method thereof App 20180190663 - Chang; Feng-Yi ; et al. | 2018-07-05 |
| Method Of Fabricating Isolation Structure App 20180108563 - Chen; Chieh-Te ; et al. | 2018-04-19 |
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