Chu; Heng-Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chu; Heng-Cheng.The latest application filed is for "method for fabricating electronic package structure".
- Chu; Heng-Cheng - Taichung City TW
- Chu; Heng-Cheng - Taichung TW
- Chu; Heng-Cheng - Taichung Hsien TW
- - Taichung TW
| Patent | Date |
|---|---|
| Method For Fabricating Electronic Package Structure App 20200161756 - Shih; Chih-Yuan ; et al. | 2020-05-21 |
| Electronic package structure Grant 10,587,037 - Chiu , et al. | 2020-03-10 |
| Electronic package structure and fabrication method thereof Grant 10,587,041 - Shih , et al. | 2020-03-10 |
| Electronic package and fabrication method thereof Grant 10,230,152 - Chiu , et al. | 2019-03-12 |
| Electronic component Grant 10,199,731 - Chiu , et al. Fe | 2019-02-05 |
| Method of manufacturing semiconductor package Grant 9,997,477 - Tsai , et al. June 12, 2 | 2018-06-12 |
| Electronic Package Structure And Fabrication Method Thereof App 20180090835 - Shih; Chih-Yuan ; et al. | 2018-03-29 |
| Electronic Component App 20170187117 - Chiu; Chih-Hsien ; et al. | 2017-06-29 |
| Electronic component Grant 9,627,748 - Chiu , et al. April 18, 2 | 2017-04-18 |
| Method Of Manufacturing Semiconductor Package App 20160225728 - Tsai; Tsung-Hsien ; et al. | 2016-08-04 |
| Semiconductor package and method of manufacturing the same Grant 9,337,250 - Tsai , et al. May 10, 2 | 2016-05-10 |
| Electronic Component App 20150162661 - Chiu; Chih-Hsien ; et al. | 2015-06-11 |
| Semiconductor Package App 20150123251 - Chiu; Chih-Hsien ; et al. | 2015-05-07 |
| Semiconductor package and fabrication method thereof Grant 8,963,299 - Lin , et al. February 24, 2 | 2015-02-24 |
| Fabrication method of carrier-free semiconductor package Grant 8,962,396 - Chen , et al. February 24, 2 | 2015-02-24 |
| Electronic Package And Fabrication Method Thereof App 20140210687 - CHIU; CHIH-HSIEN ; et al. | 2014-07-31 |
| Electronic Package Structure App 20140210672 - Chiu; Chih-Hsien ; et al. | 2014-07-31 |
| Semiconductor Package And Method Of Manufacturing The Same App 20140203395 - Tsai; Tsung-Hsien ; et al. | 2014-07-24 |
| Fabrication Method Of Carrier-free Semiconductor Package App 20140080265 - Chen; Ching-Hua ; et al. | 2014-03-20 |
| Carrier-free semiconductor package Grant 08618655 - | 2013-12-31 |
| Carrier-free semiconductor package Grant 8,618,655 - Chen , et al. December 31, 2 | 2013-12-31 |
| Semiconductor Package And Fabrication Method Thereof App 20130320513 - Lin; Chien-Cheng ; et al. | 2013-12-05 |
| Carrier-free Semiconductor Package And Fabrication Method Thereof App 20120228769 - Chen; Ching-Hua ; et al. | 2012-09-13 |
| Package structure with ESD and EMI preventing functions Grant 8,264,070 - Tsai , et al. September 11, 2 | 2012-09-11 |
| Semiconductor Package And Fabrication Method Thereof App 20120170162 - Fang; Hao-Ju ; et al. | 2012-07-05 |
| Package Structure With Esd And Emi Preventing Functions App 20120074538 - Tsai; Tsung-Hsien ; et al. | 2012-03-29 |
| Method For Adjusting Visibility Of A Display And System Thereof App 20070273680 - Yang; Ming Sheng ; et al. | 2007-11-29 |
| Universal multi-media gateway App 20040179540 - Lee, Chang-Hung ; et al. | 2004-09-16 |
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