loadpatents
name:-0.022884130477905
name:-0.016908884048462
name:-0.00041604042053223
Chu; Fu-Hua Patent Filings

Chu; Fu-Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chu; Fu-Hua.The latest application filed is for "secondary battery".

Company Profile
0.20.22
  • Chu; Fu-Hua - Taipei TW
  • CHU; Fu Hua - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Over-current protection device
Grant 10,902,980 - Dong , et al. January 26, 2
2021-01-26
Secondary battery
Grant 9,461,345 - Chu , et al. October 4, 2
2016-10-04
Secondary Battery
App 20160079638 - CHU; Fu Hua ;   et al.
2016-03-17
Radial-leaded over-current protection device
Grant 9,147,509 - Chu , et al. September 29, 2
2015-09-29
Radial-leaded Over-current Protection Device
App 20150155080 - CHU; Fu Hua ;   et al.
2015-06-04
Surface mountable over-current protection device
Grant 9,000,881 - Chu , et al. April 7, 2
2015-04-07
Surface mountable over-current protection device
Grant 8,933,775 - Wang , et al. January 13, 2
2015-01-13
Surface Mountable Over-current Protection Device
App 20140091896 - WANG; DAVID SHAU CHEW ;   et al.
2014-04-03
Over-current protection device and battery protection circuit assembly containing the same
Grant 8,687,336 - Wang , et al. April 1, 2
2014-04-01
Surface Mountable Over-current Protection Device
App 20140063671 - CHU; Fu Hua ;   et al.
2014-03-06
Over-current Protection Device And Battery Protection Circuit Assembly Containing The Same
App 20130176654 - WANG; David Shau Chew ;   et al.
2013-07-11
Surface-mounted over-current protection device
Grant RE44,224 - Wang , et al. May 21, 2
2013-05-21
Over-current protection device and method for manufacturing the same
Grant 8,421,584 - Tsai , et al. April 16, 2
2013-04-16
Heat-conductive Dielectric Polymer Material And Heat Dissipation Substrate Containing The Same
App 20130062045 - CHU; FU HUA ;   et al.
2013-03-14
Over-current Protection Device And Method For Manufacturing The Same
App 20120182118 - Tsai; Tong Cheng ;   et al.
2012-07-19
Over-current protection device
Grant 8,169,294 - Sha , et al. May 1, 2
2012-05-01
Surface-mounted over-current protection device
Grant 8,044,763 - Wang , et al. October 25, 2
2011-10-25
Heat-conductive dielectric polymer material and heat dissipation substrate containing the same
Grant 8,003,216 - Wang , et al. August 23, 2
2011-08-23
Over-current protection device
App 20110156859 - Sha; Yi An ;   et al.
2011-06-30
Surface-mounted Over-current Protection Device
App 20100134942 - WANG; Shau Chew ;   et al.
2010-06-03
Surface-mounted over-current protection device
Grant 7,701,322 - Wang , et al. April 20, 2
2010-04-20
Over-current protection device
Grant 7,382,224 - Wang , et al. June 3, 2
2008-06-03
Heat-conductive dielectric polymer material and heat dissipation substrate containing the same
App 20080073623 - Wang; David Shau Chew ;   et al.
2008-03-27
Heat dissipation substrate for electronic device
App 20080057333 - Chu; Fu Hua ;   et al.
2008-03-06
Surface-mounted over-current protection device
App 20070146112 - Wang; Shau Chew ;   et al.
2007-06-28
Over-current protection device and manufacturing method thereof
App 20070057760 - Wang; Shau Chew ;   et al.
2007-03-15
Over-current protection device
App 20070035378 - Wang; Shau Chew ;   et al.
2007-02-15
Over-current protection device
App 20070024412 - Wang; Shau Chew ;   et al.
2007-02-01
High voltage over-current protection device and manufacturing method thereof
App 20070025040 - Tsai; Tong Cheng ;   et al.
2007-02-01
Over-current protection device and manufacturing method thereof
App 20060261922 - Chu; Fu Hua ;   et al.
2006-11-23
Over-current protection device and manufacturing method thereof
App 20050140492 - Chu, Fu Hua ;   et al.
2005-06-30
Electrical devices comprising conductive polymer blend compositions
Grant 6,479,575 - Chu , et al. November 12, 2
2002-11-12
Surface mountable over-current protecting device
Grant 6,377,467 - Chu , et al. April 23, 2
2002-04-23

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