Chrysler; Gregory M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chrysler; Gregory M..The latest application filed is for "flexible interconnect pattern on semiconductor package".

Company Profile

0.101.95

Chrysler; Gregory M. - Chandler AZ US
Chrysler; Gregory M - Chandler AZ US
Chrysler; Gregory M - Sun Lakes AZ
Chrysler; Gregory M. - Sun Lakes AZ
Chrysler; Gregory M. - Chadler AZ
Chrysler; Gregory M. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus to minimize thermal impedance using copper on die backside Grant 9,406,582 - Hua , et al. August 2, 2	2016-08-02
Flexible interconnect pattern on semiconductor package Grant 8,518,750 - Tomita , et al. August 27, 2	2013-08-27
Die having a via filled with a heat-dissipating material Grant 8,505,613 - Chrysler , et al. August 13, 2	2013-08-13
Flexible Interconnect Pattern On Semiconductor Package App 20130122656 - Tomita; Yoshihiro ; et al.	2013-05-16
Flexible interconnect pattern on semiconductor package Grant 8,409,924 - Tomita , et al. April 2, 2	2013-04-02
Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns Grant 8,404,519 - Chrysler , et al. March 26, 2	2013-03-26
Method and apparatus for two-phase start-up operation Grant 8,333,569 - Sauciuc , et al. December 18, 2	2012-12-18
Compact air-plus-liquid thermal management module Grant 8,313,282 - Jarrah , et al. November 20, 2	2012-11-20
Flexible Interconnect Pattern On Semiconductor Package App 20120289002 - Tomita; Yoshihiro ; et al.	2012-11-15
Flexible interconnect pattern on semiconductor package Grant 8,227,907 - Tomita , et al. July 24, 2	2012-07-24
Cooling devices in semiconductor packages Grant 8,164,169 - Chrysler , et al. April 24, 2	2012-04-24
Carbon nanotube micro-chimney and thermo siphon die-level cooling Grant 8,125,075 - Maveety , et al. February 28, 2	2012-02-28
Carbon Nanotube Micro-chimney And Thermo Siphon Die-level Cooling App 20120021566 - Maveety; James G. ; et al.	2012-01-26
Micro-chimney And Thermosiphon Die-level Cooling App 20110297362 - Chrysler; Gregory M. ; et al.	2011-12-08
Carbon Nanotube And Metal Thermal Interface Material, Process Of Making Same, Packages Containing Same, And Systems Containing Same App 20110214285 - Chrysler; Gregory M. ; et al.	2011-09-08
Micro-chimney and thermosiphon die-level cooling Grant 8,006,747 - Chrysler , et al. August 30, 2	2011-08-30
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal Grant 7,964,447 - Chrysler , et al. June 21, 2	2011-06-21
Cooling Devices In Semiconductor Packages App 20110135015 - Chrysler; Gregory M. ; et al.	2011-06-09
Flexible Interconnect Pattern On Semiconductor Package App 20110103438 - Tomita; Yoshihiro ; et al.	2011-05-05
Flexible interconnect pattern on semiconductor package Grant 7,915,081 - Tomita , et al. March 29, 2	2011-03-29
Microelectronic package and method of cooling an interconnect feature in same Grant 7,851,905 - Chrysler , et al. December 14, 2	2010-12-14
Covered devices in a semiconductor package Grant 7,825,503 - Chrysler , et al. November 2, 2	2010-11-02
Microelectronic cooling apparatus and associated method Grant 7,795,711 - Sauciuc , et al. September 14, 2	2010-09-14
Localized microelectronic cooling apparatuses and associated methods and systems Grant 7,779,638 - Sauciuc , et al. August 24, 2	2010-08-24
Diamond substrate formation for electronic assemblies Grant 7,713,839 - Hu , et al. May 11, 2	2010-05-11
Flow-Through Air Conditioning for Electronics Racks App 20090310300 - Chrysler; Gregory M.	2009-12-17
Piezoelectric air jet augmented cooling for electronic devices Grant 7,633,753 - Sauciuc , et al. December 15, 2	2009-12-15
Covered Devices In A Semiconductor Package App 20090289353 - Chrysler; Gregory M. ; et al.	2009-11-26
Covered devices in a semiconductor package Grant 7,622,327 - Chrysler , et al. November 24, 2	2009-11-24
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Grant 7,589,417 - Ramanathan , et al. September 15, 2	2009-09-15
Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same App 20090218681 - Chrysler; Gregory M. ; et al.	2009-09-03
Piezoelectric Air Jet Augmented Cooling For Electronic Devices App 20090174999 - Sauciuc; Ioan ; et al.	2009-07-09
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same Grant 7,557,438 - Chrysler , et al. July 7, 2	2009-07-07
Flip-chip package App 20090166890 - Chrysler; Gregory M. ; et al.	2009-07-02
Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same Grant 7,550,901 - Chrysler , et al. June 23, 2	2009-06-23
Integrated Circuit Assembly Including Thermal Interface Material Comprised Of Oil Or Wax App 20090152713 - Sauciuc; Ioan ; et al.	2009-06-18
Article having metal impregnated within carbon nanotube array Grant 7,545,030 - Chrysler , et al. June 9, 2	2009-06-09
Multi-layer piezoelectric actuators with conductive polymer electrodes Grant 7,538,476 - Chrysler , et al. May 26, 2	2009-05-26
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Grant 7,537,954 - Ramanathan , et al. May 26, 2	2009-05-26
Micro-chimney and thermosiphon die-level cooling App 20090129022 - Chrysler; Gregory M. ; et al.	2009-05-21
Microelectronic Assembly And Method Of Preparing Same App 20090096087 - Sauciuc; Ioan ; et al.	2009-04-16
Enabling Bare Die Liquid Cooling For The Bare Die And Hot Spots App 20090084931 - Sauciuc; Ioan ; et al.	2009-04-02
Piezoelectric Fan, Cooling Device Containing Same, And Method Of Cooling A Microelectronic Device Using Same App 20090085438 - Chrysler; Gregory M. ; et al.	2009-04-02
Microelectronic Package And Method Of Cooling An Interconnect Feature In Same App 20090079063 - Chrysler; Gregory M. ; et al.	2009-03-26
Computer system having controlled cooling Grant 7,508,671 - Sauciuc , et al. March 24, 2	2009-03-24
Method and apparatus for dissipating heat from an electronic device Grant 7,499,278 - Sauciuc , et al. March 3, 2	2009-03-03
Micro-chimney and thermosiphon die-level cooling Grant 7,487,822 - Chrysler , et al. February 10, 2	2009-02-10
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment Grant 7,471,515 - Chang , et al. December 30, 2	2008-12-30
Apparatus To Minimize Thermal Impedance Using Copper On Die Backside App 20080296754 - Hua; Fay ; et al.	2008-12-04
Method and system to cool memory Grant 7,457,116 - Erturk , et al. November 25, 2	2008-11-25
Apparatus to minimize thermal impedance using copper on die backside Grant 7,449,780 - Hua , et al. November 11, 2	2008-11-11
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon Grant 7,435,623 - Chrysler , et al. October 14, 2	2008-10-14
Localized microelectronic cooling Grant 7,430,870 - Chau , et al. October 7, 2	2008-10-07
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,432,532 - Chrysler , et al. October 7, 2	2008-10-07
Multi-layer Piezoelectric Actuators With Conductive Polymer Electrodes App 20080238248 - Chrysler; Gregory M. ; et al.	2008-10-02
Wafer-level diamond spreader Grant 7,397,119 - Chrysler , et al. July 8, 2	2008-07-08
Method and system to cool memory App 20080158812 - Erturk; Hakan ; et al.	2008-07-03
Electronic Assembly Having An Indium Wetting Layer On A Thermally Conductive Body App 20080153210 - HUA; Fay ; et al.	2008-06-26
Application and removal of thermal interface material Grant 7,367,195 - Sauciuc , et al. May 6, 2	2008-05-06
Electronic assembly having an indium wetting layer on a thermally conductive body Grant 7,362,580 - Hua , et al. April 22, 2	2008-04-22
Liquid metal thermal interface for an integrated circuit device Grant 7,348,665 - Sauciuc , et al. March 25, 2	2008-03-25
Integrated Circuit Coolant Microchannel Assembly With Manifold Member That Facilitates Coolant Line Attachment App 20080068792 - Chang; Je-Young ; et al.	2008-03-20
Carbon nanotube micro-chimney and thermo siphon die-level cooling Grant 7,335,983 - Maveety , et al. February 26, 2	2008-02-26
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Grant 7,336,487 - Chrysler , et al. February 26, 2	2008-02-26
Preventing burst-related hazards in microelectronic cooling systems App 20080006389 - Sauciuc; Ioan ; et al.	2008-01-10
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment Grant 7,317,615 - Chang , et al. January 8, 2	2008-01-08
Method, apparatus and system for carbon nanotube wick structures App 20070284089 - Vadakkanmaruveedu; Unnikrishnan ; et al.	2007-12-13
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same App 20070252253 - Chrysler; Gregory M. ; et al.	2007-11-01
Microelectronic die having a thermoelectric module Grant 7,279,796 - Hu , et al. October 9, 2	2007-10-09
Covered devices in a semicoductor package App 20070231969 - Chrysler; Gregory M. ; et al.	2007-10-04
Integrated Circuit Coolant Microchannel With Compliant Cover App 20070230116 - Myers; Alan M. ; et al.	2007-10-04
Flexible interconnect pattern on semiconductor package App 20070231953 - Tomita; Yoshihiro ; et al.	2007-10-04
Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration App 20070217147 - Chang; Je-Young ; et al.	2007-09-20
Integrated circuit coolant microchannel assembly with targeted channel configuration Grant 7,259,965 - Chang , et al. August 21, 2	2007-08-21
Integrated circuit coolant microchannel with compliant cover Grant 7,243,705 - Myers , et al. July 17, 2	2007-07-17
Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same App 20070155136 - Chrysler; Gregory M. ; et al.	2007-07-05
Localized microelectronic cooling apparatuses and associated methods and systems App 20070144182 - Sauciuc; Ioan ; et al.	2007-06-28
Carbon nanotube micro-chimney and thermo siphon die-level cooling App 20070138623 - Maveety; James G. ; et al.	2007-06-21
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels Grant 7,218,519 - Prasher , et al. May 15, 2	2007-05-15
Integrating thermoelectric elements into wafer for heat extraction Grant 7,211,890 - Ramanathan , et al. May 1, 2	2007-05-01
Microelectronic cooling apparatus and associated method App 20070090518 - Sauciuc; Ioan ; et al.	2007-04-26
Application and removal of thermal interface material App 20070068173 - Sauciuc; Ioan ; et al.	2007-03-29
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,170,098 - Chrysler , et al. January 30, 2	2007-01-30
Localized microelectronic cooling App 20070000256 - Chau; David S. ; et al.	2007-01-04
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20060270135 - Chrysler; Gregory M. ; et al.	2006-11-30
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment App 20060262502 - Chang; Je-Young ; et al.	2006-11-23
Gap-filling in electronic assemblies including a TEC structure App 20060243315 - Chrysler; Gregory M. ; et al.	2006-11-02
Integrated circuit coolant microchannel assembly with targeted channel configuration App 20060226539 - Chang; Je-Young ; et al.	2006-10-12
Integrated circuit coolant microchannel with compliant cover App 20060196646 - Myers; Alan M. ; et al.	2006-09-07
Electronic assembly with high capacity thermal interface and methods of manufacture Grant 7,098,079 - Chrysler , et al. August 29, 2	2006-08-29
Heatsink device and method Grant 7,082,031 - Leija , et al. July 25, 2	2006-07-25
IC die with directly bonded liquid cooling device Grant 7,071,552 - Ravi , et al. July 4, 2	2006-07-04
Electro-active fluid cooling system Grant 7,063,268 - Chrysler , et al. June 20, 2	2006-06-20
Method of providing a heat spreader App 20060127672 - Chrysler; Gregory M. ; et al.	2006-06-15
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same App 20060097383 - Ramanathan; Shriram ; et al.	2006-05-11
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Grant 7,034,394 - Ramanathan , et al. April 25, 2	2006-04-25
Wafer-level diamond spreader App 20060084197 - Chrysler; Gregory M. ; et al.	2006-04-20
Electronic thermal management Grant 7,031,155 - Sauciuc , et al. April 18, 2	2006-04-18
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon App 20060071326 - Chrysler; Gregory M. ; et al.	2006-04-06
Diamond substrate formation for electronic assemblies App 20060073640 - Hu; Chuan ; et al.	2006-04-06
Micro-impeller miniature centrifugal compressor Grant 7,021,891 - Sanchez , et al. April 4, 2	2006-04-04
Wafer-level diamond spreader Grant 7,012,011 - Chrysler , et al. March 14, 2	2006-03-14
Micro-chimney and thermosiphon die-level cooling App 20060032608 - Chrysler; Gregory M. ; et al.	2006-02-16
Liquid metal thermal interface for an integrated circuit device App 20060033205 - Sauciuc; Ioan ; et al.	2006-02-16
Condensation accumulation removal apparatus and method App 20060028800 - Chrysler; Gregory M. ; et al.	2006-02-09
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon Grant 6,992,382 - Chrysler , et al. January 31, 2	2006-01-31
Micro-chimney and thermosiphon die-level cooling Grant 6,988,531 - Chrysler , et al. January 24, 2	2006-01-24
Method and apparatus for dissipating heat from an electronic device App 20060005948 - Sauciuc; Ioan ; et al.	2006-01-12
Thermoelectric module App 20060000500 - Sauciuc; Ioan ; et al.	2006-01-05
Thermoelectric cooling for microelectronic packages and dice Grant 6,981,380 - Chrysler , et al. January 3, 2	2006-01-03
Wafer-level Diamond Spreader App 20050287766 - Chrysler, Gregory M. ; et al.	2005-12-29
Electronic assembly having an indium wetting layer on a thermally conductive body App 20050280142 - Hua, Fay ; et al.	2005-12-22
Electro-active fluid cooling system App 20050279109 - Chrysler, Gregory M. ; et al.	2005-12-22
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels App 20050276014 - Prasher, Ravi S. ; et al.	2005-12-15
Method and apparatus for dissipating heat from an electronic device Grant 6,971,442 - Sauciuc , et al. December 6, 2	2005-12-06
Thermoelectric nano-wire devices App 20050257821 - Ramanathan, Shriram ; et al.	2005-11-24
Clearing of vapor lock in a microchannel cooling subsystem Grant 6,967,840 - Chrysler , et al. November 22, 2	2005-11-22
Clearing Of Vapor Lock In A Microchannel Cooling Subsystem App 20050219816 - Chrysler, Gregory M. ; et al.	2005-10-06
IC die with directly bonded liquid cooling device App 20050212121 - Ravi, Kramadhati V. ; et al.	2005-09-29
Method of forming electronic dies wherein each die has a layer of solid diamond Grant 6,936,497 - Ravi , et al. August 30, 2	2005-08-30
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same App 20050178423 - Ramanathan, Shriram ; et al.	2005-08-18
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,921,706 - Chrysler , et al. July 26, 2	2005-07-26
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon App 20050151244 - Chrysler, Gregory M. ; et al.	2005-07-14
Method and apparatus for two-phase start-up operation App 20050147500 - Sauciuc, Ioan ; et al.	2005-07-07
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20050130362 - Chrysler, Gregory M. ; et al.	2005-06-16
Computer system having controlled cooling App 20050078451 - Sauciuc, Ioan ; et al.	2005-04-14
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same App 20050077619 - Ramanathan, Shriram ; et al.	2005-04-14
Heatsink device and method App 20050068737 - Leija, Javier ; et al.	2005-03-31
Integrating thermoelectric elements into wafer for heat extraction App 20050067692 - Ramanathan, Shriram ; et al.	2005-03-31
Composite fins for heat sinks Grant 6,862,183 - Chrysler , et al. March 1, 2	2005-03-01
Microelectronic die having a thermoelectric module App 20050029637 - Hu, Chuan ; et al.	2005-02-10
Phase-change refrigeration apparatus with thermoelectric cooling element and methods Grant 6,845,622 - Sauciuc , et al. January 25, 2	2005-01-25
Application and removal of thermal interface material App 20040261988 - Sauciuc, Ioan ; et al.	2004-12-30
Electronic thermal management App 20040253130 - Sauciuc, Ioan ; et al.	2004-12-16
Apparatus and method to minimize thermal impedance using copper on die backside App 20040188817 - Hua, Fay ; et al.	2004-09-30
Phase-change refrigeration apparatus with thermoelectric cooling element and methods App 20040187501 - Sauciuc, Ioan ; et al.	2004-09-30
Method and apparatus for cooling portable computers Grant 6,795,311 - Pokharna , et al. September 21, 2	2004-09-21
Embedded liquid pump and microchannel cooling system Grant 6,785,134 - Maveety , et al. August 31, 2	2004-08-31
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20040157386 - Chrysler, Gregory M. ; et al.	2004-08-12
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,770,966 - Chrysler , et al. August 3, 2	2004-08-03
Embedded Liquid Pump And Microchannel Cooling System App 20040130874 - Maveety, James G. ; et al.	2004-07-08
Thermoelectric cooling for microelectronic packages and dice App 20040118129 - Chrysler, Gregory M. ; et al.	2004-06-24
Micro-impeller miniature centrifugal compressor App 20040120802 - Sanchez, Eduardo A. ; et al.	2004-06-24
Method of forming electronic dies wherein each die has a layer of solid diamond App 20040121561 - Ravi, Kramadhati V. ; et al.	2004-06-24
Electronic assembly with high capacity thermal interface and methods of manufacture App 20040082188 - Chrysler, Gregory M. ; et al.	2004-04-29
Composite fins for heat sinks App 20040070943 - Chrysler, Gregory M. ; et al.	2004-04-15
Electronic assembly with high capacity thermal spreader and methods of manufacture Grant 6,706,562 - Mahajan , et al. March 16, 2	2004-03-16
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,661,660 - Prasher , et al. December 9, 2	2003-12-09
Electronic assembly with high capacity thermal interface Grant 6,653,730 - Chrysler , et al. November 25, 2	2003-11-25
Piezoelectric actuated jet impingement cooling Grant 6,650,542 - Chrysler , et al. November 18, 2	2003-11-18
Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station Grant 6,646,874 - Pokharna , et al. November 11, 2	2003-11-11
Method and apparatus for dissipating heat from an electronic device App 20030205364 - Sauciuc, Ioan ; et al.	2003-11-06
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,639,799 - Prasher , et al. October 28, 2	2003-10-28
Composite fins for heat sinks Grant 6,636,423 - Rinella , et al. October 21, 2	2003-10-21
Tunnel-phase change heat exchanger Grant 6,609,561 - Sauciuc , et al. August 26, 2	2003-08-26
Diamond integrated heat spreader and method of manufacturing same App 20030152773 - Chrysler, Gregory M. ; et al.	2003-08-14
Micro-chimney and thermosiphon die-level cooling App 20030131968 - Chrysler, Gregory M. ; et al.	2003-07-17
Method and apparatus for cooling portable computers App 20030123223 - Pokharna, Himanshu ; et al.	2003-07-03
Tunnel-phase Change Heat Exchanger App 20030116302 - Sauciuc, Ioan ; et al.	2003-06-26
Composite fins for heatsinks App 20030081383 - Rinella, Agostino C. ; et al.	2003-05-01
Heat Sink And Electronic Circuit Module Including The Same App 20030062151 - Sauciuc, Ioan ; et al.	2003-04-03
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20030025198 - Chrysler, Gregory M. ; et al.	2003-02-06
Mobile computer system with detatchable thermoelectric module for enhanced cooling capability in a docking station App 20020186531 - Pokharna, Himanshu ; et al.	2002-12-12
Electronic assembly with high capacity thermal spreader and methods of manufacture App 20020105071 - Mahajan, Ravi V. ; et al.	2002-08-08
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080583 - Prasher, Ravi ; et al.	2002-06-27
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080584 - Prasher, Ravi ; et al.	2002-06-27
Electronic assembly with high capacity thermal interface and methods of manufacture App 20020074649 - Chrysler, Gregory M. ; et al.	2002-06-20
Folded Fin Heat Sinks App 20010050161 - CHRYSLER, GREGORY M. ; et al.	2001-12-13
Extended air cooling with heat loop for dense or compact configurations of electronic components App 20010006101 - Chu, Richard C. ; et al.	2001-07-05
Supplemental heating for variable load evaporative cold plates App 20010000880 - Chu, Richard C. ; et al.	2001-05-10
Extended air cooling with heat loop for dense or compact configurations of electronic components Grant 6,223,810 - Chu , et al. May 1, 2	2001-05-01
Hybrid cooling system for electronics module Grant 6,213,194 - Chrysler , et al. April 10, 2	2001-04-10
Sub-dew point cooling of electronic systems Grant 6,205,796 - Chu , et al. March 27, 2	2001-03-27
Modular refrigeration system Grant 6,035,655 - Hare , et al. March 14, 2	2000-03-14
Cooling computer systems Grant 6,034,872 - Chrysler , et al. March 7, 2	2000-03-07
Extended cooling for portable computers Grant 6,023,410 - Chu , et al. February 8, 2	2000-02-08
Modular refrigeration system Grant 5,970,731 - Hare , et al. October 26, 1	1999-10-26
Combined air and refrigeration cooling for computer systems Grant 5,963,425 - Chrysler , et al. October 5, 1	1999-10-05
Cold plate for dual refrigeration system Grant 5,954,127 - Chrysler , et al. September 21, 1	1999-09-21
Evaporator for use in an extended air cooling system for electronic components Grant 5,953,930 - Chu , et al. September 21, 1	1999-09-21
Cold plate for dual refrigeration systems Grant 5,934,364 - Chrysler , et al. August 10, 1	1999-08-10
Cold plate for dual refrigeration systems Grant 5,896,922 - Chrysler , et al. April 27, 1	1999-04-27
Enhanced flow distributor for integrated circuit spot coolers Grant 5,615,084 - Anderson , et al. March 25, 1	1997-03-25
Enhanced flow distributor for integrated circuit spot coolers Grant 5,609,202 - Anderson , et al. March 11, 1	1997-03-11
Multiple parallel impingement flow cooling with tuning Grant 5,604,665 - Chrysler , et al. February 18, 1	1997-02-18
Convertible heat exchanger for air or water cooling of electronic circuit components and the like Grant 5,482,113 - Agonafer , et al. January 9, 1	1996-01-09
Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability Grant 5,456,081 - Chrysler , et al. October 10, 1	1995-10-10
Local condensation control for liquid impingement two-phase cooling Grant 5,412,536 - Anderson , et al. May 2, 1	1995-05-02
Convertible cooling module for air or water cooling of electronic circuit components Grant 5,370,178 - Agonafer , et al. December 6, 1	1994-12-06
Electronics package with improved thermal management by thermoacoustic heat pumping Grant 5,303,555 - Chrysler , et al. April 19, 1	1994-04-19

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