Christiansen; Cathryn J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Christiansen; Cathryn J..The latest application filed is for "ic structure with interdigitated conductive elements between metal guard structures".

Company Profile

4.19.16

Christiansen; Cathryn J. - Richmond VT
Christiansen; Cathryn J. - Huntington VT
Christiansen; Cathryn J. - Essex Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IC structure with interdigitated conductive elements between metal guard structures Grant 10,770,407 - Wu , et al. Sep	2020-09-08
Ic Structure With Interdigitated Conductive Elements Between Metal Guard Structures App 20200219826 - Wu; Zhuojie ; et al.	2020-07-09
Parallel test structure Grant 10,475,677 - Shen , et al. Nov	2019-11-12
Parallel Test Structure App 20190067056 - Shen; Tian ; et al.	2019-02-28
Integrated circuit structure with continuous metal crack stop Grant 10,109,599 - Christiansen , et al. October 23, 2	2018-10-23
Integrated Circuit Structure With Continuous Metal Crack Stop App 20180174982 - Christiansen; Cathryn J. ; et al.	2018-06-21
Compound Resistor Structure For Semiconductor Device App 20180102318 - Christiansen; Cathryn J. ; et al.	2018-04-12
Electromigration testing of interconnect analogues having bottom-connected sensory pins Grant 9,851,397 - Chen , et al. December 26, 2	2017-12-26
Edge compression layers Grant 9,831,194 - Lee , et al. November 28, 2	2017-11-28
Wiring structures Grant 9,780,031 - Chen , et al. October 3, 2	2017-10-03
Interconnect structures with variable dopant levels Grant 9,768,065 - Wang , et al. September 19, 2	2017-09-19
Titanium tungsten liner used with copper interconnects Grant 9,685,370 - Chapple-Sokol , et al. June 20, 2	2017-06-20
Electromigration Testing Of Interconnect Analogues Having Bottom-connected Sensory Pins App 20160258998 - Chen; Fen ; et al.	2016-09-08
Integrated circuit (IC) test structure with monitor chain and test wires Grant 9,435,852 - Kim , et al. September 6, 2	2016-09-06
Titanium Tungsten Liner Used With Copper Interconnects App 20160181151 - Chapple-Sokol; Jonathan D. ; et al.	2016-06-23
Wiring Structures App 20160071790 - CHEN; Fen ; et al.	2016-03-10
Method of self-correcting power grid for semiconductor structures Grant 9,214,427 - Christiansen , et al. December 15, 2	2015-12-15
Method Ofself-correcting A Power Grid For Semiconductor Structures App 20150243601 - Christiansen; Cathryn J. ; et al.	2015-08-27
Alternating Open-ended Via Chains For Testing Via Formation And Dielectric Integrity App 20150221567 - Chen; Fen ; et al.	2015-08-06
Self-correcting power grid for semiconductor structures method Grant 9,087,841 - Christiansen , et al. July 21, 2	2015-07-21
Alternating open-ended via chains for testing via formation and dielectric integrity Grant 9,059,052 - Chen , et al. June 16, 2	2015-06-16
Self-correcting Power Grid For Semiconductor Structures Method App 20150115400 - Christiansen; Cathryn J. ; et al.	2015-04-30
Alternating Open-ended Via Chains For Testing Via Formation And Dielectric Integrity App 20140339558 - Chen; Fen ; et al.	2014-11-20
Thermal sensor for semiconductor circuits Grant 8,562,210 - Abadeer , et al. October 22, 2	2013-10-22
Method for fabricating air gap interconnect structures Grant 8,383,507 - Chanda , et al. February 26, 2	2013-02-26
Determining critical current density for interconnect Grant 8,232,809 - Burke , et al. July 31, 2	2012-07-31
Thermal Sensor For Semiconductor Circuits App 20120128033 - Abadeer; Wagdi W. ; et al.	2012-05-24
Air Gap Interconnect Structures And Methods For Forming The Same App 20120111825 - Chanda; Kaushik ; et al.	2012-05-10
Air gap interconnect structures and methods for forming the same Grant 8,120,179 - Chanda , et al. February 21, 2	2012-02-21
Thermo-mechanical cleavable structure Grant 8,018,017 - Chen , et al. September 13, 2	2011-09-13
Determining Critical Current Density For Interconnect App 20110115508 - Burke; Chad M. ; et al.	2011-05-19
Air Gap Interconnect Structures And Methods For Forming The Same App 20110108992 - Chanda; Kaushik ; et al.	2011-05-12
Thermo-mechanical Cleavable Structure App 20060163685 - Chen; Fen ; et al.	2006-07-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.