Choy; Ping Kong Joseph
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choy; Ping Kong Joseph.The latest application filed is for "bondhead alignment tool for a bonding apparatus".
- Choy; Ping Kong Joseph - Kwai Chung HK
- Choy; Ping Kong Joseph - Hong Kong HK
| Patent | Date |
|---|---|
| Bondhead alignment tool for a bonding apparatus Grant 7,849,896 - Choy , et al. December 14, 2 | 2010-12-14 |
| Active damping device for a positioning stage Grant 7,649,333 - Choy , et al. January 19, 2 | 2010-01-19 |
| Bondhead Alignment Tool For A Bonding Apparatus App 20090211709 - CHOY; Ping Kong Joseph ; et al. | 2009-08-27 |
| Tunable vibration absorption device Grant 7,410,039 - Or , et al. August 12, 2 | 2008-08-12 |
| Active Damping Device For A Positioning Stage App 20080169781 - CHOY; Ping Kong Joseph ; et al. | 2008-07-17 |
| Piezoelectric device with amplifying mechanism Grant 7,227,295 - Or , et al. June 5, 2 | 2007-06-05 |
| Piezoelectric device with amplifying mechanism App 20060175934 - Or; Siu Wing ; et al. | 2006-08-10 |
| Tunable vibration absorption device App 20060175169 - Or; Siu Wing ; et al. | 2006-08-10 |
| Apparatus and method for ball release Grant 6,607,118 - Cheng , et al. August 19, 2 | 2003-08-19 |
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