Chowdhury; Shaestagir

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chowdhury; Shaestagir.The latest application filed is for "void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant".

Company Profile

1.6.8

Chowdhury; Shaestagir - Portland OR
Chowdhury; Shaestagir - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant Grant 11,443,983 - Chowdhury , et al. September 13, 2	2022-09-13
Void-free High Aspect Ratio Metal Alloy Interconnects And Method Of Manufacture Using A Solvent-based Etchant App 20200098626 - CHOWDHURY; Shaestagir ; et al.	2020-03-26
Electroless Filled Conductive Structures App 20150371949 - Zierath; Daniel J. ; et al.	2015-12-24
Electroless filled conductive structures Grant 9,123,706 - Zierath , et al. September 1, 2	2015-09-01
Electroless Filled Conductive Structures App 20130270703 - Zierath; Daniel J. ; et al.	2013-10-17
Filling narrow and high aspect ratio openings with electroless deposition Grant 7,622,382 - Chowdhury , et al. November 24, 2	2009-11-24
Filling narrow and high aspect ratio openings using electroless deposition Grant 7,432,200 - Chowdhury , et al. October 7, 2	2008-10-07
Filling narrow and high aspect ratio openings with electroless deposition App 20070232044 - Chowdhury; Shaestagir ; et al.	2007-10-04
Filling narrow and high aspect ratio openings using electroless deposition App 20070141826 - Chowdhury; Shaestagir ; et al.	2007-06-21
Electroless plating baths for high aspect features Grant 7,220,296 - Chowdhury , et al. May 22, 2	2007-05-22
Method to fabricate copper-cobalt interconnects App 20060063382 - Dubin; Valery M. ; et al.	2006-03-23
Reducing wafer defects from chemical mechanical polishing App 20050164609 - Prince, Matthew ; et al.	2005-07-28

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