Chowdhury; Mohammad Kamruzzaman

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chowdhury; Mohammad Kamruzzaman.The latest application filed is for "high critical temperature metal nitride layer with oxide or oxynitride seed layer".

Company Profile

1.6.14

Chowdhury; Mohammad Kamruzzaman - Phoenix AZ
Chowdhury; Mohammad Kamruzzaman - Malta NY
Chowdhury; Mohammad Kamruzzaman - Santa Clara CA
Chowdhury; Mohammad Kamruzzaman - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Critical Temperature Metal Nitride Layer With Oxide Or Oxynitride Seed Layer App 20220052248 - Yang; Zihao ; et al.	2022-02-17
Method Of Making High Critical Temperature Metal Nitride Layer App 20220013708 - Yang; Zihao ; et al.	2022-01-13
Counter based time compensation to reduce process shifting in reactive magnetron sputtering reactor Grant 10,400,327 - Chowdhury , et al. Sep	2019-09-03
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch Grant 9,620,379 - Lei , et al. April 11, 2	2017-04-11
Etch-resistant Water Soluble Mask For Hybrid Wafer Dicing Using Laser Scribing And Plasma Etch App 20160365283 - Lei; Wei-Sheng ; et al.	2016-12-15
Counter Based Time Compensation To Reduce Process Shifting In Reactive Magnetron Sputtering Reactor App 20160222503 - Chowdhury; Mohammad Kamruzzaman ; et al.	2016-08-04
Multi-layer Mask Including Non-photodefinable Laser Energy Absorbing Layer For Substrate Dicing By Laser And Plasma Etch App 20160035577 - LEI; Wei-Sheng ; et al.	2016-02-04
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application Grant 9,252,057 - Chowdhury , et al. February 2, 2	2016-02-02
Uniform masking for wafer dicing using laser and plasma etch Grant 9,048,309 - Chowdhury , et al. June 2, 2	2015-06-02
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20150122419 - Chowdhury; Mohammad Kamruzzaman ; et al.	2015-05-07
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film Grant 8,969,177 - Chowdhury , et al. March 3, 2	2015-03-03
Laser And Plasma Etch Wafer Dicing With Partial Pre-curing Of Uv Release Dicing Tape For Film Frame Wafer Application App 20140106542 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-04-17
Uniform Masking For Wafer Dicing Using Laser And Plasma Etch App 20140017879 - Chowdhury; Mohammad Kamruzzaman ; et al.	2014-01-16
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20140004685 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-01-02

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