Chowdhury; Mahmud Halim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chowdhury; Mahmud Halim.The latest application filed is for "nanoparticle backside die adhesion layer".
- Chowdhury; Mahmud Halim - Richardson TX
- CHOWDHURY; Mahmud Halim - Addison TX
| Patent | Date |
|---|---|
| Nanoparticle Backside Die Adhesion Layer App 20210265299 - Cook; Benjamin Stassen ; et al. | 2021-08-26 |
| Nanoparticle backside die adhesion layer Grant 11,031,364 - Cook , et al. June 8, 2 | 2021-06-08 |
| Copper passivation Grant 11,021,786 - Nguyen , et al. June 1, 2 | 2021-06-01 |
| Copper Passivation App 20200173013 - Nguyen; Luu Thanh ; et al. | 2020-06-04 |
| QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same App 20190378783 - Castro; Abram ; et al. | 2019-12-12 |
| Nanoparticle Backside Die Adhesion Layer App 20190279955 - Cook; Benjamin Stassen ; et al. | 2019-09-12 |
| Method And Structure To Eliminate Substrate Coupling In Common Drain Devices App 20190206741 - PODDAR; Anindya ; et al. | 2019-07-04 |
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