Chow; Yi-Lei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chow; Yi-Lei.The latest application filed is for "substrate cleaving under controlled stress conditions".
- Chow; Yi-Lei - Los Altos CA
| Patent | Date |
|---|---|
| Substrate cleaving under controlled stress conditions Grant 9,640,711 - Henley , et al. May 2, 2 | 2017-05-02 |
| Substrate Cleaving Under Controlled Stress Conditions App 20160276522 - HENLEY; Francois ; et al. | 2016-09-22 |
| Substrate cleaving under controlled stress conditions Grant 9,356,181 - Henley , et al. May 31, 2 | 2016-05-31 |
| Substrate Cleaving Under Controlled Stress Conditions App 20150155422 - HENLEY; Francois ; et al. | 2015-06-04 |
| Substrate cleaving under controlled stress conditions Grant 8,993,410 - Henley , et al. March 31, 2 | 2015-03-31 |
| Substrate Cleaving Under Controlled Stress Conditions App 20120234887 - Henley; Francois ; et al. | 2012-09-20 |
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