loadpatents
name:-0.00039505958557129
name:-0.010409116744995
name:-0.00046515464782715
Chow; Wai Y. Patent Filings

Chow; Wai Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chow; Wai Y..The latest application filed is for "thermoplastic polymer fibre composition".

Company Profile
0.9.0
  • Chow; Wai Y. - Houston TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermoplastic polymer fibre composition
Grant 5,376,701 - Chow , et al. December 27, 1
1994-12-27
Compositions for preparing cement-adhesive reinforcing fibers
Grant 4,952,631 - McAlpin , et al. * August 28, 1
1990-08-28
Compositions for preparing cement-adhesive reinforcing fibers
Grant 4,861,812 - McAlpin , et al. August 29, 1
1989-08-29
Ternary adhesive compositions
Grant 4,839,422 - McElrath , et al. June 13, 1
1989-06-13
Composition for preparing cement--adhesive reinforcing fibers
Grant 4,801,630 - Chow , et al. January 31, 1
1989-01-31
Composition for preparing cement-adhesive reinforcing fibers
Grant 4,710,540 - McAlpin , et al. December 1, 1
1987-12-01
Novel acetylene end-capped polyesters
Grant 4,283,551 - Chow , et al. August 11, 1
1981-08-11
Polyimide oligomers
Grant 4,251,418 - Chow , et al. February 17, 1
1981-02-17
Novel acetylene end-capped polyimide oligomers
Grant 4,251,417 - Chow , et al. February 17, 1
1981-02-17

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