Chow; Wai Wong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chow; Wai Wong.The latest application filed is for "electronic device".
- Chow; Wai Wong - Tai Po HK
- Chow; Wai Wong - Kwai Chung HK
- Chow; Wai Wong - Hong Kong HK
- Chow; Wai Wong - Sheung Shui HK
- Chow; Wai Wong - Sheung Shue HK
| Patent | Date |
|---|---|
| Semiconductor device and method with clip arrangement in IC package Grant 10,825,757 - Fan , et al. November 3, 2 | 2020-11-03 |
| Electronic device Grant 10,658,274 - Boettcher , et al. | 2020-05-19 |
| Electronic Device App 20190189545 - BOETTCHER; Tim ; et al. | 2019-06-20 |
| Leadless package with non-collapsible bump Grant 10,269,751 - Chow , et al. | 2019-04-23 |
| Semiconductor Device And Method With Clip Arrangement In Ic Package App 20180174951 - Fan; Haibo ; et al. | 2018-06-21 |
| Leadless Package With Non-collapsible Bump App 20180122763 - Chow; Wai Wong ; et al. | 2018-05-03 |
| Flipchip QFN package Grant 7,112,871 - Shiu , et al. September 26, 2 | 2006-09-26 |
| Method of forming land grid array packaged device Grant 7,056,766 - Shiu , et al. June 6, 2 | 2006-06-06 |
| Method for making dual gauge leadframe Grant 7,033,866 - Chow , et al. April 25, 2 | 2006-04-25 |
| Optical sensor package Grant 6,958,261 - Chow , et al. October 25, 2 | 2005-10-25 |
| Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same Grant 6,949,816 - Brown , et al. September 27, 2 | 2005-09-27 |
| Method of packaging an optical sensor App 20050156301 - Shiu, Hei Ming ; et al. | 2005-07-21 |
| Flipchip QFN package and method therefor App 20050156291 - Shiu, Hei Ming ; et al. | 2005-07-21 |
| Dual gauge leadframe Grant 6,917,097 - Chow , et al. July 12, 2 | 2005-07-12 |
| Method Of Packaging An Optical Sensor App 20050146001 - Shiu, Hei Ming ; et al. | 2005-07-07 |
| Method of packaging an optical sensor Grant 6,905,910 - Shiu , et al. June 14, 2 | 2005-06-14 |
| Land grid array packaged device and method of forming same App 20050124147 - Shiu, Hei Ming ; et al. | 2005-06-09 |
| Dual gauge leadframe App 20050121756 - Chow, Wai Wong ; et al. | 2005-06-09 |
| Method of attaching a die to a substrate Grant 6,875,635 - Cheng , et al. April 5, 2 | 2005-04-05 |
| Flipchip QFN package and method therefor Grant 6,867,072 - Shiu , et al. March 15, 2 | 2005-03-15 |
| Dual gauge leadframe App 20050012183 - Chow, Wai Wong ; et al. | 2005-01-20 |
| Multi-row leadframe Grant 6,838,751 - Cheng , et al. January 4, 2 | 2005-01-04 |
| Semiconductor component for electrical coupling to a substrate, and method of manufacturing same App 20040207054 - Brown, Clem H. ; et al. | 2004-10-21 |
| Method of attaching a die to a substrate Grant 6,798,074 - Cheng , et al. September 28, 2 | 2004-09-28 |
| Method of attaching a die to a substrate App 20040178511 - Cheng, Man Hon ; et al. | 2004-09-16 |
| Optical sensor package App 20040080029 - Chow, Wai Wong ; et al. | 2004-04-29 |
| Optical sensor package Grant 6,667,543 - Chow , et al. December 23, 2 | 2003-12-23 |
| Multi-row leadframe App 20030168719 - Cheng, Man Hon ; et al. | 2003-09-11 |
| Method of attaching a die to a substrate App 20030164553 - Cheng, Man Hon ; et al. | 2003-09-04 |
| Semiconductor package and method for making the same App 20020177254 - Chow, Wai Wong ; et al. | 2002-11-28 |
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