CHOW; KIN YEAN
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHOW; KIN YEAN.The latest application filed is for "laser welding of thru-hole electrical components".
- CHOW; KIN YEAN - SINGAPORE SG
| Patent | Date |
|---|---|
| Laser Welding Of Thru-hole Electrical Components App 20160021747 - CHOW; KIN YEAN | 2016-01-21 |
| Wrap-around overmold for electronic assembly Grant 7,616,448 - Degenkolb , et al. November 10, 2 | 2009-11-10 |
| Interlocking overmold for electronic assembly App 20090197478 - Mandel; Larry M. ; et al. | 2009-08-06 |
| Wrap-around overmold for electronic assembly App 20090073663 - Degenkolb; Thomas A. ; et al. | 2009-03-19 |
| Overmolded electronic assembly Grant 7,462,077 - Chow , et al. December 9, 2 | 2008-12-09 |
| Overmolded electronic assembly with metal seal ring Grant 7,455,552 - Fang , et al. November 25, 2 | 2008-11-25 |
| Overmolded electronic assembly App 20080124987 - Chow; Kin Yean ; et al. | 2008-05-29 |
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