| Patent | Date |
|---|
Micro-fabricated, Stress-engineered Members Formed On Passivation Layer Of Integrated Circuit
App 20220301891 - Chua; Christopher L. ; et al. | 2022-09-22 |
Spacers Formed On A Substrate With Etched Micro-springs
App 20220301996 - Chua; Christopher L. ; et al. | 2022-09-22 |
Method and system for mass assembly of thin-film materials
Grant 11,440,307 - Lu , et al. September 13, 2 | 2022-09-13 |
Micro Assembler With Fine Angle Control
App 20220199447 - Lu; JengPing ; et al. | 2022-06-23 |
System And Method For Machine-learning Enabled Micro-assembly Control With The Aid Of A Digital Computer
App 20220188486 - Matei; Ion ; et al. | 2022-06-16 |
Method Of Controlling The Placement Of Micro-objects On A Micro-assembler
App 20220153575 - Plochowietz; Anne ; et al. | 2022-05-19 |
Method Of Controlling The Placement Of Micro-objects On A Micro-assembler
App 20220153576 - Plochowietz; Anne ; et al. | 2022-05-19 |
Micro assembler with fine angle control
Grant 11,302,554 - Lu , et al. April 12, 2 | 2022-04-12 |
Microspring structure for hardware trusted platform module
Grant 11,289,443 - Jackson , et al. March 29, 2 | 2022-03-29 |
Superconducting Stress-engineered Micro-fabricated Springs
App 20220077376 - CHUA; CHRISTOPHER L. ; et al. | 2022-03-10 |
Method of controlling the placement of micro-objects on a micro-assembler
Grant 11,242,244 - Plochowietz , et al. February 8, 2 | 2022-02-08 |
Superconducting Stress-engineered Micro-fabricated Springs
App 20210391525 - CHUA; CHRISTOPHER L. ; et al. | 2021-12-16 |
Superconducting stress-engineered micro-fabricated springs
Grant 11,201,275 - Chua , et al. December 14, 2 | 2021-12-14 |
Alignment Of Elongated Particles In A Particle Delivery Device
App 20210353865 - Biegelsen; David K. ; et al. | 2021-11-18 |
System And Method For Voltage-based Real-time Micro-object Position Control With The Aid Of A Digital Computer
App 20210356951 - Matei; Ion ; et al. | 2021-11-18 |
Method of controlling placement of micro-objects
Grant 11,148,941 - Plochowietz , et al. October 19, 2 | 2021-10-19 |
System and method for capacitance-based real-time micro-object position control with the aid of a digital computer
Grant 11,079,747 - Matei , et al. August 3, 2 | 2021-08-03 |
Alignment of elongated particles in a particle delivery device
Grant 11,077,251 - Biegelsen , et al. August 3, 2 | 2021-08-03 |
Print Head Design for Ballistic Aerosol Marking with Smooth Particulate Injection from an Array of Inlets into a Matching Array of Microchannels
App 20210178758 - Volkel; Armin R. ; et al. | 2021-06-17 |
Method And System For Mass Assembly Of Thin-film Materials
App 20210162727 - Lu; JengPing ; et al. | 2021-06-03 |
Print head design for ballistic aerosol marking with smooth particulate injection from an array of inlets into a matching array of microchannels
Grant 10,933,636 - Volkel , et al. March 2, 2 | 2021-03-02 |
Method and system for mass assembly of thin film materials
Grant 10,926,521 - Lu , et al. February 23, 2 | 2021-02-23 |
Tamper detection for breakable remakeable connections
Grant 10,921,202 - Jackson , et al. February 16, 2 | 2021-02-16 |
Method And System For Mass Assembly Of Thin Film Materials
App 20200207068 - Lu; JengPing ; et al. | 2020-07-02 |
Micro-assembler System For Controlling Placement Of Micro-objects
App 20200207615 - Plochowietz; Anne ; et al. | 2020-07-02 |
Micro-assembler System For Manipulating Micro-objects
App 20200207617 - Plochowietz; Anne ; et al. | 2020-07-02 |
System And Method For Capacitance-based Real-time Micro-object Position Control With The Aid Of A Digital Computer
App 20200201306 - Matei; Ion ; et al. | 2020-06-25 |
Micro Assembler With Fine Angle Control
App 20200194298 - Lu; JengPing ; et al. | 2020-06-18 |
High Registration Particles-transferring System
App 20200173026 - Wang; Yunda ; et al. | 2020-06-04 |
Tamper Detection For Breakable Remakeable Connections
App 20200173876 - Jackson; Warren B. ; et al. | 2020-06-04 |
High registration particles-transferring system
Grant 10,604,843 - Wang , et al. | 2020-03-31 |
System and method for scalable real-time micro-object position control with the aid of a digital computer
Grant 10,558,204 - Matei , et al. Feb | 2020-02-11 |
Alignment Of Elongated Particles In A Particle Delivery Device
App 20200016339 - Biegelsen; David K. ; et al. | 2020-01-16 |
Alignment of elongated particles in a particle delivery device
Grant 10,449,297 - Biegelsen , et al. Oc | 2019-10-22 |
Transparent optical coupler active matrix array
Grant 10,397,529 - Lu , et al. A | 2019-08-27 |
Plurality of electrodes on a substrate having different range of spacing
Grant 10,388,730 - Lu , et al. A | 2019-08-20 |
Hierarchical micro assembler system
Grant 10,308,504 - Lu , et al. | 2019-06-04 |
Point Of Care Urine Tester And Method
App 20190090859 - Recht; Michael I. ; et al. | 2019-03-28 |
High Registration Particles-transferring System
App 20180327905 - Wang; Yunda ; et al. | 2018-11-15 |
Transparent Optical Coupler Active Matrix Array
App 20180316897 - LU; JENGPING ; et al. | 2018-11-01 |
Removable Chiplet For Hardware Trusted Platform Module
App 20180307863 - Jackson; Warren B. ; et al. | 2018-10-25 |
Microchip Charge Patterning
App 20180294232 - Chow; Eugene M. ; et al. | 2018-10-11 |
Hierarchical Micro Assembler System
App 20180282150 - Lu; Jeng Ping ; et al. | 2018-10-04 |
Hierarchical Micro Assembler System
App 20180282151 - Lu; Jeng Ping ; et al. | 2018-10-04 |
Monitor for particle injector
Grant 10,064,995 - Kiesel , et al. September 4, 2 | 2018-09-04 |
System and method for enhancing particle delivery to biological tissue
Grant 10,039,885 - Chow , et al. August 7, 2 | 2018-08-07 |
Microchip charge patterning
Grant 10,014,261 - Chow , et al. July 3, 2 | 2018-07-03 |
Method of producing an interposer with microspring contacts
Grant 9,967,982 - Chow May 8, 2 | 2018-05-08 |
Printed circuit boards by massive parallel assembly
Grant 9,961,771 - Lu , et al. May 1, 2 | 2018-05-01 |
Polysensing bioelectronic test plate
Grant 9,952,122 - Veiseh , et al. April 24, 2 | 2018-04-24 |
System and Method for Scalable Real-Time Micro-Object Position Control with the Aid of a Digital Computer
App 20180081347 - Matei; Ion ; et al. | 2018-03-22 |
Polysensing Bioelectronic Test Plate
App 20170038282 - Veiseh; Mandana ; et al. | 2017-02-09 |
Monitor For Particle Injector
App 20160317747 - Kiesel; Peter ; et al. | 2016-11-03 |
Method for reduction of stiction while manipulating micro objects on a surface
Grant 9,473,047 - Thompson , et al. October 18, 2 | 2016-10-18 |
Direct electrostatic assembly with capacitively coupled electrodes
Grant 9,431,283 - Thompson , et al. August 30, 2 | 2016-08-30 |
Alignment Of Elongated Particles In A Particle Delivery Device
App 20160228646 - Biegelsen; David K. ; et al. | 2016-08-11 |
System And Method For Enhancing Particle Delivery To Biological Tissue
App 20160228647 - Chow; Eugene M. ; et al. | 2016-08-11 |
Monitor for particle injector
Grant 9,400,174 - Kiesel , et al. July 26, 2 | 2016-07-26 |
Method of Producing an Interposer with Microspring Contacts
App 20160128206 - Chow; Eugene M. | 2016-05-05 |
Fabrication method for microelectronic components and microchip inks used in electrostatic assembly
Grant 9,305,807 - Whiting , et al. April 5, 2 | 2016-04-05 |
Method for fabricating multi-chip module with multi-level interposer
Grant 9,281,268 - Chow , et al. March 8, 2 | 2016-03-08 |
Point Of Care Urine Tester And Method
App 20150359522 - Recht; Michael I. ; et al. | 2015-12-17 |
Micro-plasma generation using micro-springs
Grant 9,210,785 - Cheng , et al. December 8, 2 | 2015-12-08 |
Digital 3D fabrication using multi-layered mold
Grant 9,156,194 - Ng , et al. October 13, 2 | 2015-10-13 |
Monitor For Particle Injector
App 20150285622 - Kiesel; Peter ; et al. | 2015-10-08 |
Direct Electrostatic Assembly With Capacitively Coupled Electrodes
App 20150262856 - Thompson; Jason ; et al. | 2015-09-17 |
Fabrication Method For Microelectronic Components And Microchip Inks Used In Electrostatic Assembly
App 20150243528 - Whiting; Gregory L. ; et al. | 2015-08-27 |
Alignment structures for integrated-circuit packaging
Grant 9,111,943 - Chow , et al. August 18, 2 | 2015-08-18 |
Print Head Design for Ballistic Aerosol Marking with Smooth Particulate Injection from an Array of Inlets into a Matching Array of Microchannels
App 20150158295 - Volkel; Armin R. ; et al. | 2015-06-11 |
Micro-truss structures having in-plane structural members
Grant 9,034,563 - Schmaelzle , et al. May 19, 2 | 2015-05-19 |
Micro-Truss Structures Having In-Plane Structural Members
App 20150111158 - Schmaelzle; Philipp H. ; et al. | 2015-04-23 |
Method For Reduction Of Stiction While Manipulating Micro Objects On A Surface
App 20150076961 - Thompson; Jason ; et al. | 2015-03-19 |
Flexible metal interconnect structure
Grant 8,969,735 - Chow , et al. March 3, 2 | 2015-03-03 |
Anilox metering system for electrographic printing
Grant 8,869,695 - Chow , et al. October 28, 2 | 2014-10-28 |
Systems and methods for forming micro-object assemblies
Grant 8,850,694 - Chow , et al. October 7, 2 | 2014-10-07 |
Digital 3D Fabrication Using Multi-Layered Mold
App 20140272121 - Ng; Tse Nga ; et al. | 2014-09-18 |
Micro-Plasma Generation Using Micro-Springs
App 20140265848 - Cheng; Bowen ; et al. | 2014-09-18 |
Flexible Metal Interconnect Structure
App 20140268596 - Chow; Eugene M. ; et al. | 2014-09-18 |
Anilox metering system for electrographic printing
Grant 8,820,233 - Chow , et al. September 2, 2 | 2014-09-02 |
Micro-plasma generation using micro-springs
Grant 8,736,049 - Cheng , et al. May 27, 2 | 2014-05-27 |
Microchip Charge Patterning
App 20140106541 - Chow; Eugene M. ; et al. | 2014-04-17 |
Microchip Charge Patterning
App 20140106512 - Chow; Eugene M. ; et al. | 2014-04-17 |
Microchip charge patterning
Grant 8,685,769 - Chow , et al. April 1, 2 | 2014-04-01 |
Multilevel IC package using interconnect springs
Grant 8,686,552 - Chow , et al. April 1, 2 | 2014-04-01 |
Stress-engineered interconnect packages with activator-assisted molds
Grant 8,652,878 - Chua , et al. February 18, 2 | 2014-02-18 |
Electrostatically addressable microvalves
Grant 8,646,471 - Pattekar , et al. February 11, 2 | 2014-02-11 |
Micro-spring chip attachment using ribbon bonds
Grant 8,614,514 - Powers , et al. December 24, 2 | 2013-12-24 |
Electrostatically addressable microvalves
Grant 8,561,963 - Pattekar , et al. October 22, 2 | 2013-10-22 |
Method of Producing an Interposer with Microspring Contacts
App 20130232782 - Chow; Eugene M. | 2013-09-12 |
Microspring structures adapted for target device cooling
Grant 8,525,353 - Chow , et al. September 3, 2 | 2013-09-03 |
Microsprings partially embedded in a laminate structure and methods for producing same
Grant 8,519,534 - Chow , et al. August 27, 2 | 2013-08-27 |
Stress-engineered Interconnect Packages With Activator-assisted Molds
App 20130196471 - Chua; Christopher L. ; et al. | 2013-08-01 |
Digital imaging of marking materials by thermally induced pattern-wise transfer
Grant 8,487,970 - Stowe , et al. July 16, 2 | 2013-07-16 |
Microspring Structures Adapted for Target Device Cooling
App 20130154127 - Chow; Eugene M. ; et al. | 2013-06-20 |
Interposer with microspring contacts
Grant 8,441,808 - Chow May 14, 2 | 2013-05-14 |
Micro-machined structure production using encapsulation
Grant 8,435,612 - Hantschel , et al. May 7, 2 | 2013-05-07 |
Stress-engineered interconnect packages with activator-assisted molds
Grant 8,405,198 - Chua , et al. March 26, 2 | 2013-03-26 |
Airgap micro-spring interconnect with bonded underfill seal
Grant 8,399,296 - Chua , et al. March 19, 2 | 2013-03-19 |
Nanocalorimeter based on thermal probes
Grant 8,393,785 - De Bruyker , et al. March 12, 2 | 2013-03-12 |
Digital gravure printing with a pixilated photoconductor
Grant 8,355,035 - Chow , et al. January 15, 2 | 2013-01-15 |
Curved spring structure with downturned tip
Grant 8,330,485 - Chow , et al. December 11, 2 | 2012-12-11 |
Printed Circuit Boards By Massive Parallel Assembly
App 20120297618 - Lu; JengPing ; et al. | 2012-11-29 |
Contact spring application to semiconductor devices
Grant 8,318,542 - Chow , et al. November 27, 2 | 2012-11-27 |
Micro-assembler
Grant 8,312,619 - Chow , et al. November 20, 2 | 2012-11-20 |
Novel Electrostatically Addressable Microvalves
App 20120285550 - Pattekar; Ashish ; et al. | 2012-11-15 |
Multi-chip Module With Multi-level Interposer
App 20120266464 - Chow; Eugene M. ; et al. | 2012-10-25 |
Digital printing plate and system with electrostatically latched deformable membranes
Grant 8,291,823 - De Bruyker , et al. October 23, 2 | 2012-10-23 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
Grant 8,287,744 - Hantschel , et al. October 16, 2 | 2012-10-16 |
Printed circuit boards by massive parallel assembly
Grant 8,283,566 - Lu , et al. October 9, 2 | 2012-10-09 |
Electrostatically addressable microvalves
Grant 8,272,392 - Pattekar , et al. September 25, 2 | 2012-09-25 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
Grant 8,241,509 - Hantschel , et al. August 14, 2 | 2012-08-14 |
Multi-chip module with multi-level interposer
Grant 8,218,334 - Chow , et al. July 10, 2 | 2012-07-10 |
Micro-assembler
Grant 8,181,336 - Chow , et al. May 22, 2 | 2012-05-22 |
Airgap Micro-spring Interconnect With Bonded Underfill Seal
App 20120088330 - Chua; Christopher L. ; et al. | 2012-04-12 |
Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same
App 20120068331 - Chow; Eugene M. ; et al. | 2012-03-22 |
Interposer with microspring contacts and methods of making and using same
App 20120067637 - Chow; Eugene M. | 2012-03-22 |
Imaging members for ink-based digital printing comprising structured organic films
Grant 8,119,315 - Heuft , et al. February 21, 2 | 2012-02-21 |
Imaging Members For Ink-based Digital Printing Comprising Structured Organic Films
App 20120040283 - Heuft; Matthew A. ; et al. | 2012-02-16 |
Micro-Machined Structure Production Using Encapsulation
App 20120021170 - Hantschel; Thomas ; et al. | 2012-01-26 |
Contact Spring Application To Semiconductor Devices
App 20110318880 - Chow; Eugene M. ; et al. | 2011-12-29 |
Xerographic micro-assembler
Grant 8,082,660 - Lu , et al. December 27, 2 | 2011-12-27 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
Grant 8,080,221 - Hantschel , et al. December 20, 2 | 2011-12-20 |
Micro-machined structure production using encapsulation
Grant 8,080,293 - Hantschel , et al. December 20, 2 | 2011-12-20 |
Printing plate and system using heat-decomposable polymers
Grant 8,053,168 - Daniel , et al. November 8, 2 | 2011-11-08 |
Latent resistive image layer for high speed thermal printing applications
Grant 8,040,364 - Stowe , et al. October 18, 2 | 2011-10-18 |
Airgap micro-spring interconnect with bonded underfill seal
Grant 8,039,938 - Chua , et al. October 18, 2 | 2011-10-18 |
Alignment Structures For Integrated-circuit Packaging
App 20110227200 - Chow; Eugene M. ; et al. | 2011-09-22 |
Multi-chip Module With Multi-level Interposer
App 20110223778 - Chow; Eugene M. ; et al. | 2011-09-15 |
Contact spring application to semiconductor devices
Grant 7,982,290 - Chow , et al. July 19, 2 | 2011-07-19 |
Self-releasing spring structures and methods
Grant 7,943,504 - Hantschel , et al. May 17, 2 | 2011-05-17 |
Digital Printing Plate And System With Electrostatically Latched Deformable Membranes
App 20110107928 - De Bruyker; Dirk ; et al. | 2011-05-12 |
Anilox Metering System For Electrographic Printing
App 20110067589 - Chow; Eugene M. ; et al. | 2011-03-24 |
Anilox Metering System For Electrographic Printing
App 20110067590 - Chow; Eugene M. ; et al. | 2011-03-24 |
Digital printing plate and system with electrostatically latched deformable membranes
Grant 7,886,662 - De Bruyker , et al. February 15, 2 | 2011-02-15 |
Latent Resistive Image Layer For High Speed Thermal Printing Applications
App 20110012980 - Stowe; Timothy D. ; et al. | 2011-01-20 |
System for forming a micro-assembler
Grant 7,861,405 - Chow , et al. January 4, 2 | 2011-01-04 |
Stress-engineered Interconnect Packages With Activator-assisted Molds
App 20100295165 - Chua; Christopher L. ; et al. | 2010-11-25 |
Airgap Micro-spring Interconnect With Bonded Underfill Seal
App 20100295164 - Chua; Christopher L. ; et al. | 2010-11-25 |
Nanocalorimeter Based On Thermal Probes
App 20100290501 - De Bruyker; Dirk ; et al. | 2010-11-18 |
Curved Spring Structure With Downturned Tip
App 20100285700 - Chow; Eugene M. ; et al. | 2010-11-11 |
Novel Electrostatically Addressable Microvalves
App 20100252117 - Pattekar; Ashish ; et al. | 2010-10-07 |
Pattern-Print Thin-Film Transistors with Top Gate Geometry
App 20100252927 - Wong; William S. ; et al. | 2010-10-07 |
Imaging Member
App 20100251914 - Zhou; Jing ; et al. | 2010-10-07 |
Curved spring structure with elongated section located under cantilevered section
Grant 7,800,388 - Hantschel , et al. September 21, 2 | 2010-09-21 |
Printed Circuit Boards By Massive Parallel Assembly
App 20100230139 - Lu; JengPing ; et al. | 2010-09-16 |
Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal
App 20100213161 - Hantschel; Thomas ; et al. | 2010-08-26 |
Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal
App 20100216669 - Hantschel; Thomas ; et al. | 2010-08-26 |
Micro-assembler
App 20100192365 - CHOW; Eugene M. ; et al. | 2010-08-05 |
Micro-assembler
App 20100186221 - CHOW; Eugene M. ; et al. | 2010-07-29 |
Micro-assembler
App 20100186222 - CHOW; Eugene M. ; et al. | 2010-07-29 |
Micro-Machined Structure Production Using Encapsulation
App 20100184311 - Hantschel; Thomas ; et al. | 2010-07-22 |
Method of manufacturing fine features for thin film transistors
Grant 7,749,396 - Chow , et al. July 6, 2 | 2010-07-06 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
Grant 7,749,448 - Hantschel , et al. July 6, 2 | 2010-07-06 |
Micro-machined structure production using encapsulation
Grant 7,730,615 - Hantschel , et al. June 8, 2 | 2010-06-08 |
Digital Imaging Of Marking Materials By Thermally Induced Pattern-wise Transfer
App 20100085585 - Stowe; Timothy D. ; et al. | 2010-04-08 |
Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal
App 20090233815 - Hantschel; Thomas ; et al. | 2009-09-17 |
Micro-assembler
App 20090218260 - CHOW; Eugene M. ; et al. | 2009-09-03 |
Novel Electrostatically Addressable Microvalves
App 20090159822 - Pattekar; Ashish ; et al. | 2009-06-25 |
Vertically spaced plural microsprings
Grant 7,550,855 - Hantschel , et al. June 23, 2 | 2009-06-23 |
Method using monolayer etch masks in combination with printed masks
Grant 7,524,768 - Chow , et al. April 28, 2 | 2009-04-28 |
Integrateable capacitors and microcoils and methods of making thereof
Grant 7,517,769 - Van Schuylenbergh , et al. April 14, 2 | 2009-04-14 |
Self-Releasing Spring Structures And Methods
App 20090077807 - Hantschel; Thomas ; et al. | 2009-03-26 |
Self-releasing spring structures and methods
Grant 7,456,092 - Hantschel , et al. November 25, 2 | 2008-11-25 |
Micro-machined structure production using encapsulation
App 20080146052 - Hantschel; Thomas ; et al. | 2008-06-19 |
Digital Printing Plate And System With Electrostatically Latched Deformable Membranes
App 20080141877 - De Bruyker; Dirk ; et al. | 2008-06-19 |
Printing Plate And System Using Heat-decomposable Polymers
App 20080141880 - Daniel; Jurgen H. ; et al. | 2008-06-19 |
Patterned-Print Thin-Film Transistors with Top Gate Geometry
App 20080121884 - Wong; William S. ; et al. | 2008-05-29 |
Xerographic Micro-assembler
App 20080089705 - Lu; Jeng Ping ; et al. | 2008-04-17 |
Micro-machined structure production using encapsulation
Grant 7,356,920 - Hantschel , et al. April 15, 2 | 2008-04-15 |
Patterned-print thin-film transistors with top gate geometry
Grant 7,344,928 - Wong , et al. March 18, 2 | 2008-03-18 |
Xerographic micro-assembler
Grant 7,332,361 - Lu , et al. February 19, 2 | 2008-02-19 |
Method of manufacturing fine features for thin film transistors
App 20070221611 - Chow; Eugene M. ; et al. | 2007-09-27 |
Contact spring application to semiconductor devices
App 20070158816 - Chow; Eugene M. ; et al. | 2007-07-12 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
Grant 7,241,420 - Hantschel , et al. July 10, 2 | 2007-07-10 |
Integrateable capacitors and microcoils and methods of making thereof
App 20070145523 - Chow; Eugene M. ; et al. | 2007-06-28 |
Integrateable capacitors and microcoils and methods of making thereof
App 20070148895 - Van Schuylenbergh; Koenraad ; et al. | 2007-06-28 |
Vapor induced self-assembly and electrode sealing
App 20070139150 - Chow; Eugene M. ; et al. | 2007-06-21 |
Curved spring structure with elongated section located under cantilevered section
Grant 7,230,440 - Hantschel , et al. June 12, 2 | 2007-06-12 |
Vertically spaced plural microsprings
App 20070125486 - Hantschel; Thomas ; et al. | 2007-06-07 |
Curved spring structure with elongated section located under cantilevered section
App 20070069751 - Hantschel; Thomas ; et al. | 2007-03-29 |
Patterned-print thin-film transistors with top gate geometry
App 20070026585 - Wong; William S. ; et al. | 2007-02-01 |
Flexible cable interconnect assembly
Grant 7,121,859 - Van Schuylenbergh , et al. October 17, 2 | 2006-10-17 |
Xerographic micro-assembler
App 20060128057 - Lu; Jeng Ping ; et al. | 2006-06-15 |
Micro-machined structure production using encapsulation
App 20060105122 - Hantschel; Thomas ; et al. | 2006-05-18 |
Curved spring structure with elongated section located under cantilevered section
App 20060087335 - Hantschel; Thomas ; et al. | 2006-04-27 |
Self-releasing spring structures and methods
App 20060076693 - Hantschel; Thomas ; et al. | 2006-04-13 |
High force metal plated spring structure
Grant 7,015,584 - Chow , et al. March 21, 2 | 2006-03-21 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
App 20060057031 - Hantschel; Thomas ; et al. | 2006-03-16 |
Flexible cable interconnect assembly
App 20060009051 - Schuylenbergh; Koenraad F. Van ; et al. | 2006-01-12 |
Flexible cable interconnect assembly
Grant 6,966,784 - Van Schuylenbergh , et al. November 22, 2 | 2005-11-22 |
Integrated driver electronics for MEMS device using high voltage thin film transistors
Grant 6,912,082 - Lu , et al. June 28, 2 | 2005-06-28 |
Flexible cable interconnect assembly
App 20050136703 - Van Schuylenbergh, Koenraad F. ; et al. | 2005-06-23 |
High force metal plated spring structure
App 20050006829 - Chow, Eugene M. ; et al. | 2005-01-13 |
Scanning probe system with spring probe
Grant 6,788,086 - Hantschel , et al. September 7, 2 | 2004-09-07 |
Scanning probe system with spring probe
App 20040123651 - Hantschel, Thomas ; et al. | 2004-07-01 |
Scanning probe system with spring probe and actuation/sensing structure
Grant 6,734,425 - Hantschel , et al. May 11, 2 | 2004-05-11 |
Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal
App 20040022681 - Hantschel, Thomas ; et al. | 2004-02-05 |
Scanning probe system with spring probe
Grant 6,668,628 - Hantschel , et al. December 30, 2 | 2003-12-30 |
Scanning probe system with spring probe
App 20030182993 - Hantschel, Thomas ; et al. | 2003-10-02 |
Scanning probe system with spring probe and actuation/sensing structure
App 20030183761 - Hantschel, Thomas ; et al. | 2003-10-02 |
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