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Patent applications and USPTO patent grants for Choudhury; Pritha.The latest application filed is for "high reliability lead-free solder alloy".
Patent | Date |
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Advanced solder alloys for electronic interconnects Grant 11,411,150 - de Avila Ribas , et al. August 9, 2 | 2022-08-09 |
Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
High reliability lead-free solder alloy Grant 10,821,557 - Ribas , et al. November 3, 2 | 2020-11-03 |
High Reliability Lead-Free Solder Alloy App 20190389012 - Ribas; Morgana De Avila ;   et al. | 2019-12-26 |
Low temperature high reliability alloy for solder hierarchy Grant 10,322,471 - Choudhury , et al. | 2019-06-18 |
Advanced Solder Alloys For Electronic Interconnects App 20190157535 - de Avila Ribas; Morgana ;   et al. | 2019-05-23 |
Advanced Solder Alloys For Electronic Interconnects App 20180102464 - de Avila Ribas; Morgana ;   et al. | 2018-04-12 |
Low Temperature High Reliability Alloy for Solder Hierarchy App 20170197281 - Choudhury; Pritha ;   et al. | 2017-07-13 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ;   et al. | 2016-01-28 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ;   et al. | 2015-09-24 |
Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ;   et al. | 2015-08-13 |
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