Chou; Yu-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chou; Yu-Wei.The latest application filed is for "cmp slurry solution for hardened fluid material".

Company Profile

1.18.16

Chou; Yu-Wei - Hsinchu TW
Chou; Yu-Wei - Hsinchu City TW
CHOU; YU-WEI - TAICHUNG CITY TW
Chou; Yu-Wei - Taichung TW
Chou; Yu-Wei - Hsin-Chu TW
Chou; Yu-Wei - Coraopolis PA
Chou; Yu Wei - Moon Township PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
CMP slurry solution for hardened fluid material Grant 11,312,882 - Lin , et al. April 26, 2	2022-04-26
CMP-friendly coatings for planar recessing or removing of variable-height layers Grant 11,011,385 - Liu , et al. May 18, 2	2021-05-18
CMP Slurry Solution for Hardened Fluid Material App 20200407594 - Lin; Kuo-Yin ; et al.	2020-12-31
CMP slurry solution for hardened fluid material Grant 10,774,241 - Lin , et al. Sept	2020-09-15
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,852,899 - Lee , et al. December 26, 2	2017-12-26
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers App 20170352548 - Liu; Wen-Kuei ; et al.	2017-12-07
Metrology system and measurement method using the same Grant 9,746,310 - Hung , et al. August 29, 2	2017-08-29
CMP-friendly coatings for planar recessing or removing of variable-height layers Grant 9,748,109 - Liu , et al. August 29, 2	2017-08-29
CMP Slurry Solution for Hardened Fluid Material App 20170158914 - Lin; Kuo-Yin ; et al.	2017-06-08
Metrology System And Measurement Method Using The Same App 20170131084 - HUNG; Ying-Chieh ; et al.	2017-05-11
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20170125237 - Lee; Shen-Nan ; et al.	2017-05-04
CMP slurry solution for hardened fluid material Grant 9,567,493 - Lin , et al. February 14, 2	2017-02-14
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,559,021 - Lee , et al. January 31, 2	2017-01-31
BARC-assisted process for planar recessing or removing of variable-height layers Grant 9,478,431 - Liu , et al. October 25, 2	2016-10-25
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20160190023 - Lee; Shen-Nan ; et al.	2016-06-30
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers App 20160172209 - Liu; Wen-Kuei ; et al.	2016-06-16
Copolymer Of Dcpd-containing Benzoxazine (dcpdbz) And Cyanate Ester Resin, And Method Of Manufacturing The Copolymer App 20160137786 - SU; WEN-CHIUNG ; et al.	2016-05-19
Copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin, and method of manufacturing the copolymer Grant 9,321,889 - Su , et al. April 26, 2	2016-04-26
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers App 20160099157 - Liu; Wen-Kuei ; et al.	2016-04-07
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,287,127 - Lee , et al. March 15, 2	2016-03-15
Barc-assisted process for planar recessing or removing of variable-height layers Grant 9,236,446 - Liu , et al. January 12, 2	2016-01-12
Cmp Slurry Solution For Hardened Fluid Material App 20150307747 - Lin; Kuo-Yin ; et al.	2015-10-29
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers App 20150263132 - Liu; Wen-Kuei ; et al.	2015-09-17
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20150235858 - Lee; Shen-Nan ; et al.	2015-08-20
Methods for optimizing conductor patterns for ECP and CMP in semiconductor processing Grant 8,627,243 - Lin , et al. January 7, 2	2014-01-07
Magnetic trip mechanism including a plunger member engaging a support structure, and circuit breaker including the same Grant 7,570,140 - Helms , et al. August 4, 2	2009-08-04
Magnetic trip mechanism including a plunger member engaging a support structure, and circuit breaker including the same App 20070205852 - Helms; Roger W. ; et al.	2007-09-06
Terminal Assembly For Vented Circuit Breaker And Circuit Breaker Incorporating Same App 20060049145 - Shea; John J. ; et al.	2006-03-09
Terminal assembly for vented circuit breaker and circuit breaker incorporating same Grant 7,009,132 - Shea , et al. March 7, 2	2006-03-07
Circuit breaker and plunger assembly support structure including a positioning member Grant 6,768,404 - Ojeda , et al. July 27, 2	2004-07-27
Method of implanting metallic nanowires or nanotubes on a field emission device by flocking App 20040092050 - Shuy, Geoffrey ; et al.	2004-05-13
Arc chute with valve and electric power switch incorporating same Grant 6,703,576 - Chou , et al. March 9, 2	2004-03-09
Circuit breaker and plunger assembly support structure including a positioning member App 20040027219 - Ojeda, Ramon J. ; et al.	2004-02-12

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