| Patent | Date |
|---|
Methods of planarizing structures on wafers and substrates by polishing
Grant 6,733,685 - Beilin , et al. May 11, 2 | 2004-05-11 |
Method of fabricating a substrate with a via connection
Grant 6,662,443 - Chou , et al. December 16, 2 | 2003-12-16 |
Method of fabricating a substrate with a via connection
App 20020000037 - Chou, William T. ; et al. | 2002-01-03 |
Methods of planarizing structures on wafers and substrates by polishing
App 20010042734 - Beilin, Solomon I. ; et al. | 2001-11-22 |
Method for electroplating vias or through holes in substrates having conductors on both sides
Grant 6,197,664 - Lee , et al. March 6, 2 | 2001-03-06 |
Method of fabrication of multiple-layer high density substrate
Grant 6,187,652 - Chou , et al. February 13, 2 | 2001-02-13 |
Controlled impedance interposer substrate and method of making
Grant 6,102,710 - Beilin , et al. August 15, 2 | 2000-08-15 |
High density signal interposer with power and ground wrap
Grant 6,081,026 - Wang , et al. June 27, 2 | 2000-06-27 |
Pattern or via structure formed through supplemental electron beam exposure and development to remove image residue
Grant 5,942,373 - Chou , et al. August 24, 1 | 1999-08-24 |
Methods of planarizing structures on wafers and substrates by polishing
Grant 5,916,453 - Beilin , et al. June 29, 1 | 1999-06-29 |
Methods of etching through wafers and substrates with a composite etch stop layer
Grant 5,891,354 - Lee , et al. April 6, 1 | 1999-04-06 |
Controlled impedence interposer substrate
Grant 5,854,534 - Beilin , et al. December 29, 1 | 1998-12-29 |
Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue
Grant 5,789,140 - Chou , et al. August 4, 1 | 1998-08-04 |
Method of making a multichip module substrate
Grant 5,778,529 - Beilin , et al. July 14, 1 | 1998-07-14 |
Fabrication procedure for a stable post
Grant 5,722,162 - Chou , et al. March 3, 1 | 1998-03-03 |
Electron-beam treatment procedure for patterned mask layers
Grant 5,660,957 - Chou , et al. August 26, 1 | 1997-08-26 |
Substrate with thin film capacitor and insulating plug
Grant 5,652,693 - Chou , et al. July 29, 1 | 1997-07-29 |
Multichip module substrate
Grant 5,544,017 - Beilin , et al. August 6, 1 | 1996-08-06 |
Functional substrates for packaging semiconductor chips
Grant 5,475,262 - Wang , et al. December 12, 1 | 1995-12-12 |
Process for fabricating a substrate with thin film capacitor and insulating plug
Grant 5,455,064 - Chou , et al. October 3, 1 | 1995-10-03 |
Method for fabricating thin-film interconnector
Grant 5,419,038 - Wang , et al. May 30, 1 | 1995-05-30 |
Functional substrates for packaging semiconductor chips
Grant 5,382,827 - Wang , et al. January 17, 1 | 1995-01-17 |
Method of curing thin films of organic dielectric material
Grant 5,376,586 - Beilin , et al. December 27, 1 | 1994-12-27 |
Wire interconnect structures for connecting an integrated circuit to a substrate
Grant 5,334,804 - Love , et al. August 2, 1 | 1994-08-02 |
Process for fabricating a substrate with thin film capacitor
Grant 5,323,520 - Peters , et al. June 28, 1 | 1994-06-28 |
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