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Patent applications and USPTO patent grants for Chou; Wen-Fu.The latest application filed is for "layout structure of a flexible circuit board".
Patent | Date |
---|---|
Method of attaching heat sinks to a circuit tape Grant 11,350,518 - Lin , et al. May 31, 2 | 2022-05-31 |
Flip chip interconnection and circuit board thereof Grant 11,322,437 - Ma , et al. May 3, 2 | 2022-05-03 |
Layout structure of a flexible circuit board Grant 11,309,238 - Ma , et al. April 19, 2 | 2022-04-19 |
Layout Structure Of A Flexible Circuit Board App 20220104354 - Ma; Yu-Chen ;   et al. | 2022-03-31 |
Layout Structure Of A Flexible Circuit Board App 20220037238 - Ma; Yu-Chen ;   et al. | 2022-02-03 |
Flip Chip Interconnection And Circuit Board Thereof App 20210265255 - Ma; Yu-Chen ;   et al. | 2021-08-26 |
Chip Package And Circuit Board Thereof App 20210257287 - Ma; Yu-Chen ;   et al. | 2021-08-19 |
Method And Device Of Heat Sink Attachment To A Circuit Tape App 20210227679 - Lin; Chia-Sung ;   et al. | 2021-07-22 |
Flexible Circuit Board Having A Stiffening Structure App 20210204401 - Ma; Yu-Chen ;   et al. | 2021-07-01 |
Flip Chip Interconnection And Circuit Board Thereof App 20210202422 - Ma; Yu-Chen ;   et al. | 2021-07-01 |
Circuit board Grant 10,999,928 - Ma , et al. May 4, 2 | 2021-05-04 |
Chip package and circuit board thereof Grant 10,993,319 - Ma , et al. April 27, 2 | 2021-04-27 |
Coaxial line to microstrip connector having slots in the microstrip line for receiving an encircling metallic plate Grant 8,384,492 - Cheng , et al. February 26, 2 | 2013-02-26 |
Connector App 20120056696 - CHENG; JUI-CHING ;   et al. | 2012-03-08 |
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