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Chou; Wen-Fu Patent Filings

Chou; Wen-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chou; Wen-Fu.The latest application filed is for "layout structure of a flexible circuit board".

Company Profile
4.7.8
  • Chou; Wen-Fu - Kaohsiung TW
  • Chou; Wen-Fu - Kaohsiung City TW
  • Chou; Wen-Fu - Taipei N/A TW
  • CHOU; WEN-FU - TAIPEI CITY TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of attaching heat sinks to a circuit tape
Grant 11,350,518 - Lin , et al. May 31, 2
2022-05-31
Flip chip interconnection and circuit board thereof
Grant 11,322,437 - Ma , et al. May 3, 2
2022-05-03
Layout structure of a flexible circuit board
Grant 11,309,238 - Ma , et al. April 19, 2
2022-04-19
Layout Structure Of A Flexible Circuit Board
App 20220104354 - Ma; Yu-Chen ;   et al.
2022-03-31
Layout Structure Of A Flexible Circuit Board
App 20220037238 - Ma; Yu-Chen ;   et al.
2022-02-03
Flip Chip Interconnection And Circuit Board Thereof
App 20210265255 - Ma; Yu-Chen ;   et al.
2021-08-26
Chip Package And Circuit Board Thereof
App 20210257287 - Ma; Yu-Chen ;   et al.
2021-08-19
Method And Device Of Heat Sink Attachment To A Circuit Tape
App 20210227679 - Lin; Chia-Sung ;   et al.
2021-07-22
Flexible Circuit Board Having A Stiffening Structure
App 20210204401 - Ma; Yu-Chen ;   et al.
2021-07-01
Flip Chip Interconnection And Circuit Board Thereof
App 20210202422 - Ma; Yu-Chen ;   et al.
2021-07-01
Circuit board
Grant 10,999,928 - Ma , et al. May 4, 2
2021-05-04
Chip package and circuit board thereof
Grant 10,993,319 - Ma , et al. April 27, 2
2021-04-27
Coaxial line to microstrip connector having slots in the microstrip line for receiving an encircling metallic plate
Grant 8,384,492 - Cheng , et al. February 26, 2
2013-02-26
Connector
App 20120056696 - CHENG; JUI-CHING ;   et al.
2012-03-08

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