Chou; Tsung-Te

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chou; Tsung-Te.The latest application filed is for "method of detecting delamination in an integrated circuit package structure".

Company Profile

3.5.6

Chou; Tsung-Te - Taipei TW
CHOU; Tsung-Te - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of detecting delamination in an integrated circuit package structure Grant 10,699,977 - Chen , et al.	2020-06-30
Method Of Detecting Delamination In An Integrated Circuit Package Structure App 20190333829 - CHEN; Yang-Che ; et al.	2019-10-31
Integrated circuit package structure and testing method using the same Grant 10,347,548 - Chen , et al. July 9, 2	2019-07-09
Composite Conducive To Heat Dissipation Of Led-mounted Substrate And Method Of Manufacturing The Same App 20180294392 - WENG; BIING-JYH ; et al.	2018-10-11
Integrated Circuit Package Structure And Testing Method Using The Same App 20180156865 - Chen; Yang-Che ; et al.	2018-06-07
Air trench in packages incorporating hybrid bonding Grant 9,786,628 - Chou , et al. October 10, 2	2017-10-10
Air Trench in Packages Incorporating Hybrid Bonding App 20170069593 - Chou; Bruce C.S. ; et al.	2017-03-09
Air trench in packages incorporating hybrid bonding Grant 9,502,396 - Chou , et al. November 22, 2	2016-11-22
Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2	2016-09-13
Air Trench in Packages Incorporating Hybrid Bonding App 20160163684 - Chou; Bruce C.S. ; et al.	2016-06-09
Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al.	2014-09-18

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