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Patent applications and USPTO patent grants for CHOU; Tien-Pei.The latest application filed is for "contact metallization process".
Patent | Date |
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Contact Metallization Process App 20210280462 - CHOU; Tien-Pei ;   et al. | 2021-09-09 |
Contact metallization process Grant 10,964,590 - Chou , et al. March 30, 2 | 2021-03-30 |
Methods And Apparatus For Similar Data Reuse In Dataflow Processing Systems App 20200210759 - Chou; Tien-Pei ;   et al. | 2020-07-02 |
Semiconductor device with TiN adhesion layer for forming a contact plug Grant 10,332,789 - Chou , et al. | 2019-06-25 |
Semiconductor Device With TiN Adhesion Layer For Forming A Contact Plug App 20190164822 - CHOU; Tien-Pei ;   et al. | 2019-05-30 |
Contact Metallization Process App 20190148223 - CHOU; Tien-Pei ;   et al. | 2019-05-16 |
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