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Chou; Ming-Chun Patent Filings

Chou; Ming-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chou; Ming-Chun.The latest application filed is for "induction heating cooker and control circuit therefor".

Company Profile
0.8.8
  • Chou; Ming-Chun - Banciao TW
  • Chou; Ming-Chun - Taipei County N/A TW
  • CHOU; Ming-Chun - Banciao City TW
  • Chou; Ming-Chun - Banqiao TW
  • Chou; Ming-Chun - Banqiao-City TW
  • Chou, Ming-Chun - Vancouver WA
  • Chou, Ming-Chun - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Induction heating cooker and control circuit therefor
Grant 9,313,830 - Gong , et al. April 12, 2
2016-04-12
ESD protection for high-voltage-tolerance open-drain output pad
Grant 8,493,700 - Hsihe , et al. July 23, 2
2013-07-23
Induction heating cooker and control circuit therefor
Grant 8,476,563 - Gong , et al. July 2, 2
2013-07-02
Induction Heating Cooker And Control Circuit Therefor
App 20130008892 - GONG; Pei-Min ;   et al.
2013-01-10
ESD protection for high-voltage-tolerance open-drain output pad
Grant 8,164,870 - Hsihe , et al. April 24, 2
2012-04-24
Esd Protection For High-voltage-tolerance Open-drain Output Pad
App 20120044605 - HSIHE; WU-TSUNG ;   et al.
2012-02-23
Power noise immunity circuit
App 20090243714 - Chou; Ming-Chun ;   et al.
2009-10-01
ESD protection for high-voltage-tolerance open-drain output pad
App 20090213508 - Hsihe; Wu-Tsung ;   et al.
2009-08-27
Induction Heating Cooker And Control Circuit Therefor
App 20090173732 - GONG; Pei-Min ;   et al.
2009-07-09
Brush positioning device for a wafer cleaning station
App 20050229950 - Chou, Ming-Chun ;   et al.
2005-10-20
Automatic in situ pellicle height measurement system
Grant 6,778,285 - Nguyen , et al. August 17, 2
2004-08-17
Fix the glassivation layer's micro crack point precisely by using electroplating method
App 20010016420 - Chou, Ming-Chun
2001-08-23
Check abnormal contact and via holes by electroplating method
App 20010016365 - Chou, Ming-Chun ;   et al.
2001-08-23

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