Chou; Li-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chou; Li-Ming.The latest application filed is for "halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same".
- Chou; Li-Ming - Tao-Yuan Hsien TW
| Patent | Date |
|---|---|
| Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same Grant 9,288,904 - Wang , et al. March 15, 2 | 2016-03-15 |
| Halogen-free resin composition Grant 9,238,733 - Li , et al. January 19, 2 | 2016-01-19 |
| Halogen-free Resin Composition, Copper Clad Laminate Using The Same, And Printed Circuit Board Using The Same App 20140023839 - WANG; RONG-TAO ; et al. | 2014-01-23 |
| Halogen-free Resin Composition App 20130316155 - LI; CHANG-YUAN ; et al. | 2013-11-28 |
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