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Buried metal for FinFET device and method
Grant 11,424,154 - Chou , et al. August 23, 2 | 2022-08-23 |
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20220216112 - CHIANG; Hung-Li ; et al. | 2022-07-07 |
Method of manufacturing a semiconductor device and a semiconductor device
Grant 11,289,384 - Chiang , et al. March 29, 2 | 2022-03-29 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method
App 20210384351 - CHEN; CHIH-LIANG ; et al. | 2021-12-09 |
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
Grant 11,121,256 - Chen , et al. September 14, 2 | 2021-09-14 |
Local Interconnect Structure
App 20210280607 - CHEN; Chih-Liang ; et al. | 2021-09-09 |
Buried Metal for FinFET Device and Method
App 20210193504 - Chou; Lei-Chun ; et al. | 2021-06-24 |
High-Density Semiconductor Device
App 20210166947 - Chou; Lei-Chun ; et al. | 2021-06-03 |
Local interconnect structure
Grant 11,018,157 - Chen , et al. May 25, 2 | 2021-05-25 |
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20210118745 - CHIANG; Hung-Li ; et al. | 2021-04-22 |
High-density semiconductor device
Grant 10,950,456 - Chou , et al. March 16, 2 | 2021-03-16 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20210028311 - Chen; Chih-Liang ; et al. | 2021-01-28 |
Self aligned via and method for fabricating the same
Grant 10,879,120 - Chen , et al. December 29, 2 | 2020-12-29 |
Buried metal for FinFET device and method
Grant 10,867,833 - Chou , et al. December 15, 2 | 2020-12-15 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20200388706 - CHEN; Chih-Liang ; et al. | 2020-12-10 |
Method of manufacturing a semiconductor device and a semiconductor device
Grant 10,861,750 - Chiang , et al. December 8, 2 | 2020-12-08 |
Metal rail conductors for non-planar semiconductor devices
Grant 10,804,402 - Chen , et al. October 13, 2 | 2020-10-13 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method
App 20200303551 - CHEN; CHIH-LIANG ; et al. | 2020-09-24 |
Metal rail conductors for non-planar semiconductor devices
Grant 10,763,365 - Chen , et al. Sep | 2020-09-01 |
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
Grant 10,700,207 - Chen , et al. | 2020-06-30 |
High-Density Semiconductor Device
App 20200043741 - Chou; Lei-Chun ; et al. | 2020-02-06 |
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20200006155 - CHIANG; Hung-Li ; et al. | 2020-01-02 |
High-density semiconductor device
Grant 10,446,406 - Chou , et al. Oc | 2019-10-15 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20190165177 - CHEN; Chih-Liang ; et al. | 2019-05-30 |
Metal Rail Conductors For Non-planar Semiconductor Devices
App 20190165178 - CHEN; Chih-Liang ; et al. | 2019-05-30 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method
App 20190164882 - CHEN; CHIH-LIANG ; et al. | 2019-05-30 |
Buried Metal for FinFET Device and Method
App 20190164805 - Chou; Lei-Chun ; et al. | 2019-05-30 |
Local Interconnect Structure
App 20190096909 - Chen; Chih-Liang ; et al. | 2019-03-28 |
High-density semiconductor device
Grant 10,032,759 - Chen , et al. July 24, 2 | 2018-07-24 |
Self Aligned Via and Method for Fabricating the Same
App 20180151432 - Chen; Chih-Liang ; et al. | 2018-05-31 |
High-Density Semiconductor Device
App 20180151551 - Chen; Chih-Liang ; et al. | 2018-05-31 |
High-Density Semiconductor Device
App 20180151381 - Chou; Lei-Chun ; et al. | 2018-05-31 |
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