Chou; Kuang-Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chou; Kuang-Chun.The latest application filed is for "leadframe with die pad and leads corresponding thereto".
- Chou; Kuang-Chun - Kaohsiung TW
- Chou; Kuang-chun - Kaohsiung City TW
- Chou; Kuang-Chun - Kaoshiung TW
- Chou; Kuang-Chun - Kaohsiung Hsien TW
| Patent | Date |
|---|---|
| Leadframe with die pad and leads corresponding thereto Grant 7,812,431 - Yang , et al. October 12, 2 | 2010-10-12 |
| Leadframe With Die Pad And Leads Corresponding Thereto App 20080303128 - Yang; Su-Tai ; et al. | 2008-12-11 |
| Method For Forming Slot On Substrate And Structure Thereof App 20080263852 - Chang; Shih-ching ; et al. | 2008-10-30 |
| Method for cleaning and regenerating a mold Grant 7,429,342 - Chou September 30, 2 | 2008-09-30 |
| Method for cleaning and regenerating a mold App 20050037178 - Chou, Kuang Chun | 2005-02-17 |
| Substrate strip with sides having flanges and recesses Grant 6,828,002 - Chou , et al. December 7, 2 | 2004-12-07 |
| Cleaning substrate for cleaning and regenerating a mold Grant 6,803,089 - Chou October 12, 2 | 2004-10-12 |
| Die bonder Grant 6,722,412 - Huang , et al. April 20, 2 | 2004-04-20 |
| Die bonder App 20030094241 - Huang, Yao-Ting ; et al. | 2003-05-22 |
| Substrate strip with sides having flanges and recesses App 20030072913 - Chou, Kuang-Chun ; et al. | 2003-04-17 |
| Cleaning substrate for cleaning and regenerating a mold App 20030034049 - Chou, Kuang Chun | 2003-02-20 |
| Stacked chip assembly utilizing a lead frame Grant 6,118,176 - Tao , et al. September 12, 2 | 2000-09-12 |
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