loadpatents
Patent applications and USPTO patent grants for Chou; Hung-Ju.The latest application filed is for "germanium hump reduction".
Patent | Date |
---|---|
Germanium hump reduction Grant 11,437,245 - Fu , et al. September 6, 2 | 2022-09-06 |
Germanium Hump Reduction App 20220102151 - Fu; Shih-Hao ;   et al. | 2022-03-31 |
Semiconductor Structure And Related Methods App 20220028744 - CHOU; Hung-Ju ;   et al. | 2022-01-27 |
Silicon-Germanium Fins and Methods of Processing the Same in Field-Effect Transistors App 20210257462 - Lu; Yu-Shan ;   et al. | 2021-08-19 |
Bent Fin Devices App 20210257360 - Kuo; Jiun-Ming ;   et al. | 2021-08-19 |
Fin Loss Prevention App 20210249312 - CHOU; Hung-Ju ;   et al. | 2021-08-12 |
Fin Field-Effect Transistor Device And Method App 20210210354 - Wang; Yin ;   et al. | 2021-07-08 |
Fin field-effect transistor device and method Grant 10,964,548 - Wang , et al. March 30, 2 | 2021-03-30 |
Fin Field-Effect Transistor Device And Method App 20200006077 - Wang; Yin ;   et al. | 2020-01-02 |
Fin field-effect transistor device and method Grant 10,497,577 - Wang , et al. De | 2019-12-03 |
Fin Field-Effect Transistor Device And Method App 20190067027 - Wang; Yin ;   et al. | 2019-02-28 |
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