Patent | Date |
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Method and structure of middle layer removal Grant 11,398,380 - Chen , et al. July 26, 2 | 2022-07-26 |
Semiconductor Devices and Methods of Manufacturing App 20210257218 - Hsu; Wan Hsuan ;   et al. | 2021-08-19 |
Semiconductor Devices and Methods of Manufacturing App 20210118689 - Hsu; Wan Hsuan ;   et al. | 2021-04-22 |
Semiconductor devices and methods of manufacturing Grant 10,985,028 - Hsu , et al. April 20, 2 | 2021-04-20 |
Semiconductor device and method Grant 10,755,972 - Chen , et al. A | 2020-08-25 |
Method And Structure Of Middle Layer Removal App 20200266065 - CHEN; Nai-Chia ;   et al. | 2020-08-20 |
Method and structure of middle layer removal Grant 10,658,179 - Chen , et al. | 2020-05-19 |
Method And Structure Of Middle Layer Removal App 20200058502 - Chen; Nai-Chia ;   et al. | 2020-02-20 |
Chemical clean of semiconductor device Grant 10,354,913 - Chen , et al. July 16, 2 | 2019-07-16 |
Chemical Clean Of Semiconductor Device App 20180350664 - Chen; Nai-Chia ;   et al. | 2018-12-06 |
Semiconductor Device and Method App 20180151421 - Chen; Nai-Chia ;   et al. | 2018-05-31 |
Aqueous cleaning techniques and compositions for use in semiconductor device manufacture Grant 9,728,533 - Chou , et al. August 8, 2 | 2017-08-08 |
Semiconductor device and method of manufacture Grant 9,263,337 - Chou , et al. February 16, 2 | 2016-02-16 |
Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing Grant 9,117,760 - Hsu , et al. August 25, 2 | 2015-08-25 |
Apparatus to improve internal wafer temperature profile Grant 9,048,089 - Hsu , et al. June 2, 2 | 2015-06-02 |
Aqueous Cleaning Techniques And Compositions For Use In Semiconductor Device Manufacture App 20150108578 - Chou; Chun-Li ;   et al. | 2015-04-23 |
Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing Grant 8,916,429 - Chou , et al. December 23, 2 | 2014-12-23 |
Apparatus to Improve Internal Wafer Temperature Profile App 20140224785 - Hsu; Yu-Yen ;   et al. | 2014-08-14 |
Method And System For Energized And Pressurized Liquids For Cleaning/etching Applications In Semiconductor Manufacturing App 20140213063 - HSU; Yu-Yen ;   et al. | 2014-07-31 |
Aqueous Cleaning Techniques and Compositions for use in Semiconductor Device Manufacturing App 20130288436 - Chou; Chun-Li ;   et al. | 2013-10-31 |
Method for backside polymer reduction in dry-etch process Grant 8,529,783 - Chen , et al. September 10, 2 | 2013-09-10 |
Semiconductor Device and Method of Manufacture App 20130109140 - Chou; Chun-Li ;   et al. | 2013-05-02 |
Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process Grant 7,968,506 - Chou , et al. June 28, 2 | 2011-06-28 |
Method for backside polymer reduction in dry-etch process App 20100190349 - Chen; Huang-Ming ;   et al. | 2010-07-29 |
Method and apparatus for backside polymer reduction in dry-etch process Grant 7,713,380 - Chen , et al. May 11, 2 | 2010-05-11 |
Wet Cleaning Stripping Of Etch Residue After Trench And Via Opening Formation In Dual Damascene Process App 20100055897 - Chou; Chun-Li ;   et al. | 2010-03-04 |
Wet cleaning cavitation system and method to remove particulate wafer contamination Grant 7,373,941 - Chou , et al. May 20, 2 | 2008-05-20 |
Cleaning porous low-k material in the formation of an interconnect structure App 20070254476 - Chou; Chun-Li ;   et al. | 2007-11-01 |
Wet cleaning method to eliminate copper corrosion Grant 7,022,610 - Chou , et al. April 4, 2 | 2006-04-04 |
Tool for cleaning substrates Grant 6,974,505 - Shih , et al. December 13, 2 | 2005-12-13 |
Method and apparatus for backside polymer reduction in dry-etch process App 20050164506 - Chen, Huang-Ming ;   et al. | 2005-07-28 |
Wet cleaning method to eliminate copper corrosion App 20050136678 - Chou, Chun-Li ;   et al. | 2005-06-23 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor Grant 6,864,193 - Chou , et al. March 8, 2 | 2005-03-08 |
Wet cleaning cavitation system and method to remove particulate wafer contamination App 20040187891 - Chou, Chun-Li ;   et al. | 2004-09-30 |
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor App 20040175964 - Chou, Chun-Li ;   et al. | 2004-09-09 |