CHOU; Chi-Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHOU; Chi-Yu.The latest application filed is for "formation and in-situ etching processes for metal layers".
- CHOU; Chi-Yu - Zhubei City TW
- Chou; Chi-Yu - Zhubei TW
| Patent | Date |
|---|---|
| Formation And In-situ Etching Processes For Metal Layers App 20210111027 - LIN; Po-Yu ; et al. | 2021-04-15 |
| Formation and in-situ etching processes for metal layers Grant 10,872,769 - Lin , et al. December 22, 2 | 2020-12-22 |
| Formation And In-situ Etching Processes For Metal Layers App 20200135471 - LIN; Po-Yu ; et al. | 2020-04-30 |
| Formation and in-situ etching processes for metal layers Grant 10,535,523 - Lin , et al. Ja | 2020-01-14 |
| Barrier layer for copper interconnect Grant 9,064,934 - Lin , et al. June 23, 2 | 2015-06-23 |
| Barrier Layer for Copper Interconnect App 20150044867 - Lin; Yu-Hung ; et al. | 2015-02-12 |
| Barrier layer for copper interconnect Grant 8,872,342 - Lin , et al. October 28, 2 | 2014-10-28 |
| Method for forming seed layer structure Grant 8,778,801 - Chiang , et al. July 15, 2 | 2014-07-15 |
| Barrier Layer for Copper Interconnect App 20140191402 - Lin; Yu-Hung ; et al. | 2014-07-10 |
| Barrier layer for copper interconnect Grant 8,722,531 - Lin , et al. May 13, 2 | 2014-05-13 |
| Barrier Layer For Copper Interconnect App 20140117547 - Lin; Yu-Hung ; et al. | 2014-05-01 |
| Seed Layer Structure and Method App 20140084470 - Chiang; Chen-Bin ; et al. | 2014-03-27 |
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