| Patent | Date |
|---|
Projection device and light source system and projection method thereof
Grant 11,106,120 - Chou , et al. August 31, 2 | 2021-08-31 |
Method For Manufacturing Semiconductor Structure
App 20210043518 - CHOU; Chen-Cheng ; et al. | 2021-02-11 |
Semiconductor structure having trench and manufacturing method thereof
Grant 10,818,558 - Chou , et al. October 27, 2 | 2020-10-27 |
Illumination System, Projection Apparatus And Illumination Control Method
App 20200081332 - Chou; Chen-Cheng ; et al. | 2020-03-12 |
Projection Device And Light Source System And Projection Method Thereof
App 20200073221 - Chou; Chen-Cheng ; et al. | 2020-03-05 |
Light Detecting Element And Projection Apparatus
App 20190384147 - CHU; WEN-HAO ; et al. | 2019-12-19 |
Tilt implantation for STI formation in FinFET structures
Grant 9,570,557 - Chou , et al. February 14, 2 | 2017-02-14 |
Tilt Implantation For Sti Formation In Finfet Structures
App 20160322462 - CHOU; Chen Cheng ; et al. | 2016-11-03 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160315014 - CHOU; Chen-Cheng ; et al. | 2016-10-27 |
On-chip heat spreader
Grant 8,779,572 - Lin , et al. July 15, 2 | 2014-07-15 |
Seal ring in an integrated circuit die
Grant 8,742,583 - Lin , et al. June 3, 2 | 2014-06-03 |
On-Chip Heat Spreader
App 20140054761 - Lin; Chuan-Yi ; et al. | 2014-02-27 |
On-chip heat spreader
Grant 8,609,506 - Lin , et al. December 17, 2 | 2013-12-17 |
On-Chip Heat Spreader
App 20130078765 - Lin; Chuan-Yi ; et al. | 2013-03-28 |
Three-dimensional Glasses And Method For Operating The Same
App 20130002654 - Yeh; Tse-Fan ; et al. | 2013-01-03 |
On-chip heat spreader
Grant 8,314,483 - Lin , et al. November 20, 2 | 2012-11-20 |
Metal-oxide-metal structure with improved capacitive coupling area
Grant 8,207,567 - Chin , et al. June 26, 2 | 2012-06-26 |
Seal Ring in an Integrated Circuit Die
App 20120112322 - Lin; Chuan-Yi ; et al. | 2012-05-10 |
Forming seal ring in an integrated circuit die
Grant 8,168,529 - Lin , et al. May 1, 2 | 2012-05-01 |
Forming Seal Ring in an Integrated Circuit Die
App 20100187671 - Lin; Chuan-Yi ; et al. | 2010-07-29 |
On-Chip Heat Spreader
App 20100187670 - Lin; Chuan-Yi ; et al. | 2010-07-29 |
Metal-oxide-metal Structure With Improved Capacitive Coupling Area
App 20100123214 - CHEN; CHAO-CHI ; et al. | 2010-05-20 |
Method for forming a metal layer in multiple steps
App 20060237320 - Lin; K.Y. ; et al. | 2006-10-26 |
Sacrificial feature for corrosion prevention during CMP
Grant 6,787,470 - Hu , et al. September 7, 2 | 2004-09-07 |
Sacrificial feature for corrosion prevention during CMP
App 20030216047 - Hu, Chu-Wei ; et al. | 2003-11-20 |
Non-distort spacer profile during subsequent processing
Grant 6,346,449 - Chang , et al. February 12, 2 | 2002-02-12 |
Fabrication process for MOSFET devices and a reproducible capacitor structure
Grant 6,004,841 - Chang , et al. December 21, 1 | 1999-12-21 |
Method for making improved polysilicon FET gate electrode structures and sidewall spacers for more reliable self-aligned contacts (SAC)
Grant 5,817,562 - Chang , et al. October 6, 1 | 1998-10-06 |
Fabrication process for MOSFET devices and a reproducible capacitor structure
Grant 5,792,681 - Chang , et al. August 11, 1 | 1998-08-11 |
Process for integrating a MOSFET device, using silicon nitride spacers and a self-aligned contact structure, with a capacitor structure
Grant 5,766,992 - Chou , et al. June 16, 1 | 1998-06-16 |
| 